Projects per year
Fingerprint
Collaborations and top research areas from the last five years
Profiles
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Harold Ackler
- Micron School of Materials Science and Engineering - Clinical Associate Professor
Person
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E-RISE: Capacity Building for Resilient Microelectronics for Extreme Environments (XTREME) Program
Estrada, D. (PI) & Icharit@uidahoedu, I. C. (CoPI)
1/08/26 → 31/07/30
Project: Research
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Planning: IUSE/PFE:RED Planning: Creating Innovative SPACE in Mechanical Engineering Education Powered by Industry Engagement and AI Integration
Lujan, T. (PI) & Dwiniecki@boisestateedu, D. J. W. (CoPI)
15/07/26 → 30/06/28
Project: Research
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POSE: Phase I: Establishing the Retico Spoken Dialogue Open-Source Ecosystem for Social Robots
Kennington, C. (PI) & Ross@semioai, R. A. M. (CoPI)
15/07/26 → 30/06/27
Project: Research
Research output
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From Scores to Alarms: NP-Calibrated Event-Level Detection with a Multi-horizon Digital Twin for ICS
Mehrpouyan, H., 2027, Cybersecurity - 10th European Interdisciplinary Cybersecurity Conference, EICC 2026, Proceedings. Renaud, K., Wendzel, S. & Heinemann, A. (eds.). Springer Science and Business Media Deutschland GmbH, p. 185-200 16 p. (Communications in Computer and Information Science; vol. 3012 CCIS).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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2D and Layered Materials for Additive Manufacturing of Energy Storage and Harvesting Devices
Estrada, D., 2026, Proceedings of the 13th International Conference on Fluid Flow, Heat and Mass Transfer, FFHMT 2026. Kruczek, B., Ahmed, W. H., Ein-Mozaffari, F., Wang, H. & Darkwa, J. (eds.). (International Conference on Fluid Flow, Heat and Mass Transfer; vol. 8).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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2-dimensional and Layered Materials for Applications in Energy, Water, and Healthcare
Estrada, D., 2026, 10th IEEE Electron Devices Technology and Manufacturing Conference: Emerging Semiconductor Devices and Manufacturing Technologies, EDTM 2026. Institute of Electrical and Electronics Engineers Inc., (10th IEEE Electron Devices Technology and Manufacturing Conference: Emerging Semiconductor Devices and Manufacturing Technologies, EDTM 2026).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
Activities
- 1 Editorial
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AWWA Water Science (Journal)
Hull, N. M. (Editor)
1 Jan 2020 → …Activity: Publication peer-review and editorial work › Editorial
Prizes
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Presidential Early Career Award for Scientists and Engineers (PECASE)
Estrada, D. (Recipient), 14 Jan 2025
Prize: Other distinction
Press/Media
Datasets
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Code and Data for a Real-time Structural Seismic Response Prediction Framework based on Transfer Learning and Unsupervised Learning
Pak, H. (Creator) & Paal, S. G. (Creator), Texas A&M University, 29 Jun 2023
Dataset
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Evaluation of Transfer Learning Models for Predicting the Lateral Strength of Reinforced Concrete Columns
Pak, H. (Creator) & Paal, S. G. (Creator), Texas A&M University, 9 Jul 2022
Dataset
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A Knowledge Transfer Enhanced Ensemble Approach to Predict the Shear Capacity of Reinforced Concrete Deep Beams without Stirrups
Pak, H. (Creator) & Paal, S. G. (Creator), Texas A&M University, 15 Dec 2022
Dataset