17.5 A 0.8mm3 Ultrasonic Implantable Wireless Neural Recording System with Linear AM Backscattering

Mohammad Meraj Ghanbari; David K. Piech; Konlin Shen; Sina Faraji Alamouti; Cem Yalcin; Benjamin C. Johnson; Jose M. Carmena; Michel M. Maharbiz; Rikky Muller

doi:10.1109/ISSCC.2019.8662295

17.5 A 0.8mm³ Ultrasonic Implantable Wireless Neural Recording System with Linear AM Backscattering

Mohammad Meraj Ghanbari, David K. Piech, Konlin Shen, Sina Faraji Alamouti, Cem Yalcin, Benjamin C. Johnson, Jose M. Carmena, Michel M. Maharbiz, Rikky Muller

Electrical Engineering Department

University of California at Berkeley

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

43 Scopus citations

Abstract

Miniaturization of implantable neural recording systems to micron-scale volumes will enable minimally invasive implantation and alleviate cortical scarring, gliosis, and resulting signal degradation. Ultrasound (US) power transmission has been demonstrated to have high efficiency and low tissue attenuation for mm-scale implants at depth in tissue [1, 2, 3], but has not been demonstrated with precision recording circuitry. We present an US implantable wireless neural recording system scaled to 0.8mm³, verified to safely operate at 5cm depth with state of the art neural recording performance an average circuit power dissipation of 13μW, and 28.8μW including power conversion efficiency. Sub-mm scale is achieved through single-link power and communication on a single piezocrystal (Lead Zirconate Titanate, PZT) utilizing linear analog backscattering, small die area, and eliminating all other off-chip components.

Original language	English
Title of host publication	2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	284-286
Number of pages	3
ISBN (Electronic)	9781538685310
DOIs	https://doi.org/10.1109/ISSCC.2019.8662295
State	Published - 6 Mar 2019
Event	2019 IEEE International Solid-State Circuits Conference, ISSCC 2019 - San Francisco, United States Duration: 17 Feb 2019 → 21 Feb 2019

Publication series

Name	Digest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume	2019-February
ISSN (Print)	0193-6530

Conference

Conference	2019 IEEE International Solid-State Circuits Conference, ISSCC 2019
Country/Territory	United States
City	San Francisco
Period	17/02/19 → 21/02/19

Access to Document

10.1109/ISSCC.2019.8662295

Cite this

Ghanbari, M. M., Piech, D. K., Shen, K., Alamouti, S. F., Yalcin, C., Johnson, B. C., Carmena, J. M., Maharbiz, M. M., & Muller, R. (2019). 17.5 A 0.8mm³ Ultrasonic Implantable Wireless Neural Recording System with Linear AM Backscattering. In 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019 (pp. 284-286). Article 8662295 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 2019-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSCC.2019.8662295

Ghanbari, Mohammad Meraj ; Piech, David K. ; Shen, Konlin et al. / 17.5 A 0.8mm³ Ultrasonic Implantable Wireless Neural Recording System with Linear AM Backscattering. 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 284-286 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

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title = "17.5 A 0.8mm3 Ultrasonic Implantable Wireless Neural Recording System with Linear AM Backscattering",

abstract = "Miniaturization of implantable neural recording systems to micron-scale volumes will enable minimally invasive implantation and alleviate cortical scarring, gliosis, and resulting signal degradation. Ultrasound (US) power transmission has been demonstrated to have high efficiency and low tissue attenuation for mm-scale implants at depth in tissue [1, 2, 3], but has not been demonstrated with precision recording circuitry. We present an US implantable wireless neural recording system scaled to 0.8mm3, verified to safely operate at 5cm depth with state of the art neural recording performance an average circuit power dissipation of 13μW, and 28.8μW including power conversion efficiency. Sub-mm scale is achieved through single-link power and communication on a single piezocrystal (Lead Zirconate Titanate, PZT) utilizing linear analog backscattering, small die area, and eliminating all other off-chip components.",

author = "Ghanbari, {Mohammad Meraj} and Piech, {David K.} and Konlin Shen and Alamouti, {Sina Faraji} and Cem Yalcin and Johnson, {Benjamin C.} and Carmena, {Jose M.} and Maharbiz, {Michel M.} and Rikky Muller",

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Ghanbari, MM, Piech, DK, Shen, K, Alamouti, SF, Yalcin, C, Johnson, BC, Carmena, JM, Maharbiz, MM & Muller, R 2019, 17.5 A 0.8mm³ Ultrasonic Implantable Wireless Neural Recording System with Linear AM Backscattering. in 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019., 8662295, Digest of Technical Papers - IEEE International Solid-State Circuits Conference, vol. 2019-February, Institute of Electrical and Electronics Engineers Inc., pp. 284-286, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019, San Francisco, United States, 17/02/19. https://doi.org/10.1109/ISSCC.2019.8662295

17.5 A 0.8mm³ Ultrasonic Implantable Wireless Neural Recording System with Linear AM Backscattering. / Ghanbari, Mohammad Meraj; Piech, David K.; Shen, Konlin et al.
2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 284-286 8662295 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 2019-February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Alamouti, Sina Faraji

AU - Yalcin, Cem

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Ghanbari MM, Piech DK, Shen K, Alamouti SF, Yalcin C, Johnson BC et al. 17.5 A 0.8mm³ Ultrasonic Implantable Wireless Neural Recording System with Linear AM Backscattering. In 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 284-286. 8662295. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference). doi: 10.1109/ISSCC.2019.8662295