Abstract
Memory-centric computing systems have demonstrated superior performance and efficiency in memory-intensive applications compared to state-of-the-art CPUs and GPUs. 3-D stacked DRAM architectures unlock higher I/O data bandwidth than the traditional 2-D memory architecture and therefore are better suited for incorporating memory-centric processors. However, merely integrating high-precision ALUs in the 3-D stacked memory does not ensure an optimized design since such a design can only achieve a limited utilization of the internal bandwidth of a memory chip and limited operational parallelization. To address this, we propose 3DL-PIM, a 3-D stacked memory-based Processing in Memory (PIM) architecture that locates a plurality of Look-up Table (LUT)-based low-footprint Processing Elements (PE) within the memory banks in order to achieve high parallel computing performance by maximizing data-bandwidth utilization. Instead of relying on the traditional logic-based ALUs, the PEs are formed by clustering a group of programmable LUTs and therefore can be programmed on-the-fly to perform various logic/arithmetic operations. Our simulations show that 3DL-PIM can achieve respectively up to 2.6× higher processing performance at 2.65× higher area efficiency compared to a state-of-the-art 3-D stacked memory-based accelerator.
Original language | American English |
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Pages (from-to) | 60-72 |
Number of pages | 13 |
Journal | IEEE Transactions on Emerging Topics in Computing |
Volume | 12 |
Issue number | 1 |
DOIs | |
State | Published - Jan 2024 |
Externally published | Yes |
Keywords
- 3-D memory
- data encryption
- deep neural networks
- look-up table
- parallel processing
- processing-in-memory
EGS Disciplines
- Electrical and Computer Engineering