A Wireless Millimetre-Scale Implantable Neural Stimulator with Ultrasonically Powered Bidirectional Communication

Benjamin C. Johnson, David K. Piech, Konlin Shen, M. Meraj Ghanbari, Ka Yiu Li, Ryan M. Neely, Joshua E. Kay, Jose M. Carmena, Michel M. Maharbiz, Rikky Muller

Research output: Contribution to journalArticlepeer-review

329 Scopus citations

Abstract

Clinically approved neural stimulators are limited by battery requirements, as well as by their large size compared with the stimulation targets. Here, we describe a wireless, leadless and battery-free implantable neural stimulator that is 1.7 mm 3 and that incorporates a piezoceramic transducer, an energy-storage capacitor and an integrated circuit. An ultrasonic link and a hand-held external transceiver provide the stimulator with power and bidirectional communication. The stimulation protocols were wirelessly encoded on the fly, reducing power consumption and on-chip memory, and enabling protocol complexity with a high temporal resolution and low-latency feedback. Uplink data indicating whether stimulation occurs are encoded by the stimulator through backscatter modulation and are demodulated at the external transceiver. When embedded in ex vivo porcine tissue, the integrated circuit efficiently harvested ultrasonic power, decoded downlink data for the stimulation parameters and generated current-controlled stimulation pulses. When cuff-mounted and acutely implanted onto the sciatic nerve of anaesthetized rats, the device conferred repeatable stimulation across a range of physiological responses. The miniaturized neural stimulator may facilitate closed-loop neurostimulation for therapeutic interventions.

Original languageAmerican English
Pages (from-to)207-222
Number of pages16
JournalNature Biomedical Engineering
Volume4
Issue number2
DOIs
StatePublished - 1 Feb 2020

Keywords

  • biomedical engineering
  • brain-machine interface
  • electrical and electronic engineering
  • implants
  • therapeutics

EGS Disciplines

  • Electrical and Computer Engineering

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