TY - GEN
T1 - An on-chip 72×60 angle-sensitive single photon image sensor array for lens-less time-resolved 3-D fluorescence lifetime imaging
AU - Lee, Changhyuk
AU - Johnson, Ben
AU - Molnar, Alyosha
PY - 2014
Y1 - 2014
N2 - We present a 72×60, angle-sensitive single photon avalanche diode (A-SPAD) array, able to perform lens-less 3-D fluorescent lifetime imaging. A-SPAD pixels are comprised of (1) a SPAD to resolve precise timing information, reject high-powered UV stimulus, and map the lifetimes of different fluorescent sources and (2) integrated diffraction gratings over the SPAD to extract the incident angle of light, enabling 3-D localization at a micrometer scale. The chip integrates pixel-level counters and shared timing circuitry, and is implemented in unmodified 180nm CMOS.
AB - We present a 72×60, angle-sensitive single photon avalanche diode (A-SPAD) array, able to perform lens-less 3-D fluorescent lifetime imaging. A-SPAD pixels are comprised of (1) a SPAD to resolve precise timing information, reject high-powered UV stimulus, and map the lifetimes of different fluorescent sources and (2) integrated diffraction gratings over the SPAD to extract the incident angle of light, enabling 3-D localization at a micrometer scale. The chip integrates pixel-level counters and shared timing circuitry, and is implemented in unmodified 180nm CMOS.
UR - http://www.scopus.com/inward/record.url?scp=84905652761&partnerID=8YFLogxK
U2 - 10.1109/VLSIC.2014.6858427
DO - 10.1109/VLSIC.2014.6858427
M3 - Conference contribution
AN - SCOPUS:84905652761
SN - 9781479933273
T3 - IEEE Symposium on VLSI Circuits, Digest of Technical Papers
BT - 2014 Symposium on VLSI Circuits, VLSIC 2014 - Digest of Technical Papers
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 28th IEEE Symposium on VLSI Circuits, VLSIC 2014
Y2 - 10 June 2014 through 13 June 2014
ER -