Analysis of transient thermal management characteristics of PCM with an embedded carbon fiber heat sink

Amy S. Fleischer; Randy D. Weinstein; Thomas Kopec

doi:10.1109/ITHERM.2006.1645490

Analysis of transient thermal management characteristics of PCM with an embedded carbon fiber heat sink

Amy S. Fleischer
, Randy D. Weinstein
, Thomas Kopec

Villanova University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5 Scopus citations

Abstract

There has been a strong interest in the use of phase change materials (PCMs) for the transient thermal abatement of small size electronics and several experimental studies have examined various aspects of PCM implementation. However, the adaptation of this technology for larger systems will require a scale-up in both physical size and power density. In larger volumes, the poor thermal conductivity of the PCM itself (around 0.2 W/m·K) becomes a considerable limitation. The thermal resistance into a large volume of PCM is significant and the design must be adapted to facilitate greater heat flow into the PCM container. This study experimentally investigates the performance of PCM with an embedded light weight carbon fiber heat sink as an effective thermal management technique for high power transient applications.

Original language	English
Title of host publication	Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
Pages	1265-1268
Number of pages	4
DOIs	https://doi.org/10.1109/ITHERM.2006.1645490
State	Published - 2006
Externally published	Yes
Event	10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006 - San Diego, CA, United States Duration: 30 May 2006 → 2 Jun 2006

Publication series

Name	Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
Volume	2006

Conference

Conference	10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
Country/Territory	United States
City	San Diego, CA
Period	30/05/06 → 2/06/06

Keywords

Carbon fibers
Electronics cooling
PCMs
Phase change materials
Thermal management of electronics
Transient thermal management

Access to Document

10.1109/ITHERM.2006.1645490

Cite this

Fleischer, A. S., Weinstein, R. D., & Kopec, T. (2006). Analysis of transient thermal management characteristics of PCM with an embedded carbon fiber heat sink. In Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006 (pp. 1265-1268). Article 1645490 (Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference; Vol. 2006). https://doi.org/10.1109/ITHERM.2006.1645490

Fleischer, Amy S. ; Weinstein, Randy D. ; Kopec, Thomas. / Analysis of transient thermal management characteristics of PCM with an embedded carbon fiber heat sink. Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006. 2006. pp. 1265-1268 (Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference).

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title = "Analysis of transient thermal management characteristics of PCM with an embedded carbon fiber heat sink",

abstract = "There has been a strong interest in the use of phase change materials (PCMs) for the transient thermal abatement of small size electronics and several experimental studies have examined various aspects of PCM implementation. However, the adaptation of this technology for larger systems will require a scale-up in both physical size and power density. In larger volumes, the poor thermal conductivity of the PCM itself (around 0.2 W/m·K) becomes a considerable limitation. The thermal resistance into a large volume of PCM is significant and the design must be adapted to facilitate greater heat flow into the PCM container. This study experimentally investigates the performance of PCM with an embedded light weight carbon fiber heat sink as an effective thermal management technique for high power transient applications.",

keywords = "Carbon fibers, Electronics cooling, PCMs, Phase change materials, Thermal management of electronics, Transient thermal management",

author = "Fleischer, \{Amy S.\} and Weinstein, \{Randy D.\} and Thomas Kopec",

year = "2006",

doi = "10.1109/ITHERM.2006.1645490",

language = "English",

isbn = "0780395247",

series = "Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference",

pages = "1265--1268",

booktitle = "Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006",

note = "10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006 ; Conference date: 30-05-2006 Through 02-06-2006",

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Fleischer, AS, Weinstein, RD & Kopec, T 2006, Analysis of transient thermal management characteristics of PCM with an embedded carbon fiber heat sink. in Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006., 1645490, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, vol. 2006, pp. 1265-1268, 10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006, San Diego, CA, United States, 30/05/06. https://doi.org/10.1109/ITHERM.2006.1645490

Analysis of transient thermal management characteristics of PCM with an embedded carbon fiber heat sink. / Fleischer, Amy S.; Weinstein, Randy D.; Kopec, Thomas.
Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006. 2006. p. 1265-1268 1645490 (Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference; Vol. 2006).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Fleischer, Amy S.

AU - Weinstein, Randy D.

AU - Kopec, Thomas

PY - 2006

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N2 - There has been a strong interest in the use of phase change materials (PCMs) for the transient thermal abatement of small size electronics and several experimental studies have examined various aspects of PCM implementation. However, the adaptation of this technology for larger systems will require a scale-up in both physical size and power density. In larger volumes, the poor thermal conductivity of the PCM itself (around 0.2 W/m·K) becomes a considerable limitation. The thermal resistance into a large volume of PCM is significant and the design must be adapted to facilitate greater heat flow into the PCM container. This study experimentally investigates the performance of PCM with an embedded light weight carbon fiber heat sink as an effective thermal management technique for high power transient applications.

AB - There has been a strong interest in the use of phase change materials (PCMs) for the transient thermal abatement of small size electronics and several experimental studies have examined various aspects of PCM implementation. However, the adaptation of this technology for larger systems will require a scale-up in both physical size and power density. In larger volumes, the poor thermal conductivity of the PCM itself (around 0.2 W/m·K) becomes a considerable limitation. The thermal resistance into a large volume of PCM is significant and the design must be adapted to facilitate greater heat flow into the PCM container. This study experimentally investigates the performance of PCM with an embedded light weight carbon fiber heat sink as an effective thermal management technique for high power transient applications.

KW - Carbon fibers

KW - Electronics cooling

KW - PCMs

KW - Phase change materials

KW - Thermal management of electronics

KW - Transient thermal management

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ER -

Fleischer AS, Weinstein RD, Kopec T. Analysis of transient thermal management characteristics of PCM with an embedded carbon fiber heat sink. In Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006. 2006. p. 1265-1268. 1645490. (Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference). doi: 10.1109/ITHERM.2006.1645490

Analysis of transient thermal management characteristics of PCM with an embedded carbon fiber heat sink

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Keywords

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