Brittle and ductile fracture mechanics analysis of surface damage caused during CMP

Terry A. Ring; Paul Feeney; David Boldridge; Jaishankar Kasthurirangan; Shoutian Li; James A. Dirksen

doi:10.1149/1.2426877

Brittle and ductile fracture mechanics analysis of surface damage caused during CMP

Terry A. Ring, Paul Feeney, David Boldridge, Jaishankar Kasthurirangan, Shoutian Li, James A. Dirksen

Chemistry Department

Research output: Contribution to journal › Article › peer-review

53 Scopus citations

Abstract

This work reviews the mechanical properties and fracture mechanics of materials important in the manufacture of multilayer interconnects on silicon chips in order to understand surface damage caused during chemical mechanical polishing (CMP). It gives an explanation for chatter marks, surface flaking in interlayer dielectric material, and rolling indenter and plastic plow lines in copper on the wafer surface during CMP of silicon chips.

Original language	English
Pages (from-to)	H239-H248
Journal	Journal of the Electrochemical Society
Volume	154
Issue number	3
DOIs	https://doi.org/10.1149/1.2426877
State	Published - 2007

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10.1149/1.2426877

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title = "Brittle and ductile fracture mechanics analysis of surface damage caused during CMP",

abstract = "This work reviews the mechanical properties and fracture mechanics of materials important in the manufacture of multilayer interconnects on silicon chips in order to understand surface damage caused during chemical mechanical polishing (CMP). It gives an explanation for chatter marks, surface flaking in interlayer dielectric material, and rolling indenter and plastic plow lines in copper on the wafer surface during CMP of silicon chips.",

author = "Ring, \{Terry A.\} and Paul Feeney and David Boldridge and Jaishankar Kasthurirangan and Shoutian Li and Dirksen, \{James A.\}",

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T1 - Brittle and ductile fracture mechanics analysis of surface damage caused during CMP

AU - Ring, Terry A.

AU - Feeney, Paul

AU - Boldridge, David

AU - Kasthurirangan, Jaishankar

AU - Li, Shoutian

AU - Dirksen, James A.

PY - 2007

Y1 - 2007

N2 - This work reviews the mechanical properties and fracture mechanics of materials important in the manufacture of multilayer interconnects on silicon chips in order to understand surface damage caused during chemical mechanical polishing (CMP). It gives an explanation for chatter marks, surface flaking in interlayer dielectric material, and rolling indenter and plastic plow lines in copper on the wafer surface during CMP of silicon chips.

AB - This work reviews the mechanical properties and fracture mechanics of materials important in the manufacture of multilayer interconnects on silicon chips in order to understand surface damage caused during chemical mechanical polishing (CMP). It gives an explanation for chatter marks, surface flaking in interlayer dielectric material, and rolling indenter and plastic plow lines in copper on the wafer surface during CMP of silicon chips.

UR - https://www.scopus.com/pages/publications/33846980503

U2 - 10.1149/1.2426877

DO - 10.1149/1.2426877

M3 - Article

AN - SCOPUS:33846980503

SN - 0013-4651

VL - 154

SP - H239-H248

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

IS - 3

ER -

Brittle and ductile fracture mechanics analysis of surface damage caused during CMP

Abstract

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