Correlation of defects on dielectric surfaces with large particle counts in chemical-mechanical planarization (CMP) slurries using a new single particle optical sensing (SPOS) technique

Edward E. Remsen; Sriram P. Anjur; David Boldridge; Mungai Kamiti; Shoutian Li

doi:10.1557/proc-867-w4.2

Correlation of defects on dielectric surfaces with large particle counts in chemical-mechanical planarization (CMP) slurries using a new single particle optical sensing (SPOS) technique

Edward E. Remsen, Sriram P. Anjur, David Boldridge, Mungai Kamiti, Shoutian Li

Chemistry Department

Cabot Microelectronics Corporation

Research output: Contribution to journal › Conference article › peer-review

7 Scopus citations

Abstract

A dual-sensor single particle optical sensing method (SPOS) is described for the measurement of the large particle count (LPC) in fumed silica polishing slurries. LPC values were expressed on a silica sphere-equivalent diameter scale rather than a polystyrene latex-equivalent size basis. Linear correlations between LPC and scratch counts on SiO₂ surface films for wafers polished under clean room and table-top CMP conditions are demonstrated. However, these correlations were obtained for a limited set of model slurries; and further investigation will be needed to assess the general applicability of dual-sensor SPOS for oxide scratch defect prediction in CMP slurries.

Original language	English
Article number	W4.2
Pages (from-to)	57-62
Number of pages	6
Journal	Materials Research Society Symposium Proceedings
Volume	867
DOIs	https://doi.org/10.1557/proc-867-w4.2
State	Published - 2005
Event	2005 Materials Research Society Spring Meeting - San Francisco, CA, United States Duration: 28 Mar 2005 → 31 Mar 2005

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Remsen, E. E., Anjur, S. P., Boldridge, D., Kamiti, M., & Li, S. (2005). Correlation of defects on dielectric surfaces with large particle counts in chemical-mechanical planarization (CMP) slurries using a new single particle optical sensing (SPOS) technique. Materials Research Society Symposium Proceedings, 867, 57-62. Article W4.2. https://doi.org/10.1557/proc-867-w4.2

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title = "Correlation of defects on dielectric surfaces with large particle counts in chemical-mechanical planarization (CMP) slurries using a new single particle optical sensing (SPOS) technique",

abstract = "A dual-sensor single particle optical sensing method (SPOS) is described for the measurement of the large particle count (LPC) in fumed silica polishing slurries. LPC values were expressed on a silica sphere-equivalent diameter scale rather than a polystyrene latex-equivalent size basis. Linear correlations between LPC and scratch counts on SiO2 surface films for wafers polished under clean room and table-top CMP conditions are demonstrated. However, these correlations were obtained for a limited set of model slurries; and further investigation will be needed to assess the general applicability of dual-sensor SPOS for oxide scratch defect prediction in CMP slurries.",

author = "Remsen, {Edward E.} and Anjur, {Sriram P.} and David Boldridge and Mungai Kamiti and Shoutian Li",

year = "2005",

doi = "10.1557/proc-867-w4.2",

language = "English",

volume = "867",

pages = "57--62",

journal = "Materials Research Society Symposium Proceedings",

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note = "2005 Materials Research Society Spring Meeting ; Conference date: 28-03-2005 Through 31-03-2005",

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Correlation of defects on dielectric surfaces with large particle counts in chemical-mechanical planarization (CMP) slurries using a new single particle optical sensing (SPOS) technique. / Remsen, Edward E.; Anjur, Sriram P.; Boldridge, David et al.
In: Materials Research Society Symposium Proceedings, Vol. 867, W4.2, 2005, p. 57-62.

Research output: Contribution to journal › Conference article › peer-review

TY - JOUR

T1 - Correlation of defects on dielectric surfaces with large particle counts in chemical-mechanical planarization (CMP) slurries using a new single particle optical sensing (SPOS) technique

AU - Remsen, Edward E.

AU - Anjur, Sriram P.

AU - Boldridge, David

AU - Kamiti, Mungai

AU - Li, Shoutian

PY - 2005

Y1 - 2005

N2 - A dual-sensor single particle optical sensing method (SPOS) is described for the measurement of the large particle count (LPC) in fumed silica polishing slurries. LPC values were expressed on a silica sphere-equivalent diameter scale rather than a polystyrene latex-equivalent size basis. Linear correlations between LPC and scratch counts on SiO2 surface films for wafers polished under clean room and table-top CMP conditions are demonstrated. However, these correlations were obtained for a limited set of model slurries; and further investigation will be needed to assess the general applicability of dual-sensor SPOS for oxide scratch defect prediction in CMP slurries.

AB - A dual-sensor single particle optical sensing method (SPOS) is described for the measurement of the large particle count (LPC) in fumed silica polishing slurries. LPC values were expressed on a silica sphere-equivalent diameter scale rather than a polystyrene latex-equivalent size basis. Linear correlations between LPC and scratch counts on SiO2 surface films for wafers polished under clean room and table-top CMP conditions are demonstrated. However, these correlations were obtained for a limited set of model slurries; and further investigation will be needed to assess the general applicability of dual-sensor SPOS for oxide scratch defect prediction in CMP slurries.

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SN - 0272-9172

VL - 867

SP - 57

EP - 62

JO - Materials Research Society Symposium Proceedings

JF - Materials Research Society Symposium Proceedings

M1 - W4.2

T2 - 2005 Materials Research Society Spring Meeting

Y2 - 28 March 2005 through 31 March 2005

ER -

Correlation of defects on dielectric surfaces with large particle counts in chemical-mechanical planarization (CMP) slurries using a new single particle optical sensing (SPOS) technique

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