Correlation of defects on dielectric surfaces with large particle counts in chemical-mechanical planarization (CMP) slurries using a new single particle optical sensing (SPOS) technique

  • Edward E. Remsen
  • , Sriram P. Anjur
  • , David Boldridge
  • , Mungai Kamiti
  • , Shoutian Li

Research output: Contribution to journalConference articlepeer-review

7 Scopus citations

Abstract

A dual-sensor single particle optical sensing method (SPOS) is described for the measurement of the large particle count (LPC) in fumed silica polishing slurries. LPC values were expressed on a silica sphere-equivalent diameter scale rather than a polystyrene latex-equivalent size basis. Linear correlations between LPC and scratch counts on SiO2 surface films for wafers polished under clean room and table-top CMP conditions are demonstrated. However, these correlations were obtained for a limited set of model slurries; and further investigation will be needed to assess the general applicability of dual-sensor SPOS for oxide scratch defect prediction in CMP slurries.

Original languageEnglish
Article numberW4.2
Pages (from-to)57-62
Number of pages6
JournalMaterials Research Society Symposium Proceedings
Volume867
DOIs
StatePublished - 2005
Event2005 Materials Research Society Spring Meeting - San Francisco, CA, United States
Duration: 28 Mar 200531 Mar 2005

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