Abstract
A dual-sensor single particle optical sensing method (SPOS) is described for the measurement of the large particle count (LPC) in fumed silica polishing slurries. LPC values were expressed on a silica sphere-equivalent diameter scale rather than a polystyrene latex-equivalent size basis. Linear correlations between LPC and scratch counts on SiO2 surface films for wafers polished under clean room and table-top CMP conditions are demonstrated. However, these correlations were obtained for a limited set of model slurries; and further investigation will be needed to assess the general applicability of dual-sensor SPOS for oxide scratch defect prediction in CMP slurries.
| Original language | English |
|---|---|
| Article number | W4.2 |
| Pages (from-to) | 57-62 |
| Number of pages | 6 |
| Journal | Materials Research Society Symposium Proceedings |
| Volume | 867 |
| DOIs | |
| State | Published - 2005 |
| Event | 2005 Materials Research Society Spring Meeting - San Francisco, CA, United States Duration: 28 Mar 2005 → 31 Mar 2005 |
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