Crack propagation in lamellar TiAl under mode i loading

Fu Pen Chiang, Yi Ding, Gunes Uzer, Andrew Ho, Andrew H. Rosenberger

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A unique macro/micro- speckle technique for deformation measurement is exploited to investigate the crack propagation characteristics of lamellar TiAl with the grain size of approximately 450μm. A single edge notch (SEN) specimen tested under uniaxial tension inside a scanning electron microscope (SEM). The specimen was gradually loaded under incremental forces and the SEM image was taken at each step of the loading until it failed. The displacement and strain fields were measured using the electron speckle technique. The analysis of data shows that the lamellar orientation and grain boundary of TiAl play major roles in the characteristics of crack propagation. The highest resistance to crack advance is when the crack is normal to the lamellar orientation whereas the weakest link is when the interface is parallel to the orientation of the crack. Moreover, we find that a concentrated strain filed tends to be the prelude of a sudden crack jump. The shear strain also plays an important role in crack advance by shear banding.

Original languageEnglish
Title of host publicationProceedings of the 2006 SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2006
Pages1999-2005
Number of pages7
StatePublished - 2006
EventSEM Annual Conference and Exposition on Experimental and Applied Mechanics 2006 - Saint Louis, MO, United States
Duration: 4 Jun 20067 Jun 2006

Publication series

NameProceedings of the 2006 SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2006
Volume4

Conference

ConferenceSEM Annual Conference and Exposition on Experimental and Applied Mechanics 2006
Country/TerritoryUnited States
CitySaint Louis, MO
Period4/06/067/06/06

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