Degradation of rise time in NAND gates using 2.0 nm gate dielectrics

M. L. Ogas, P. M. Price, J. Kiepert, R. J. Baker, G. Bersuker, W. B. Knowlton

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

CMOS NAND gate circuit performance degradation caused by a single pMOSFET wearout induced by constant voltage stress in 2.0 nm gate dielectrics is examined using a switch matrix technique. The NAND gate rise time is found to increase by approximately 64%, which may lead to timing errors in high frequency digital circuits. The degraded pMOSFET reveals that a decrease in drive current by 41% and an increase in threshold voltage by 18% are directly proportional to an increase in channel resistance, thereby substantially increasing the NAND gate circuit timing delay.

Original languageEnglish
Title of host publication2005 IEEE International Integrated Reliability Workshop Final Report, IIRW 2005
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages63-66
Number of pages4
ISBN (Print)0780389921, 9780780389922
DOIs
StatePublished - 2005
Event2005 IEEE International Integrated Reliability Workshop, IIRW 2005 - S. Lake Tahoe, CA, United States
Duration: 17 Oct 200520 Oct 2005

Publication series

NameIEEE International Integrated Reliability Workshop Final Report
Volume2005
ISSN (Print)1930-8841
ISSN (Electronic)2374-8036

Conference

Conference2005 IEEE International Integrated Reliability Workshop, IIRW 2005
Country/TerritoryUnited States
CityS. Lake Tahoe, CA
Period17/10/0520/10/05

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