TY - GEN
T1 - Design, fabrication and implementation of smart three axis compliant interconnects for ultra-thin chip stacking technology
AU - Arunasalam, Parthiban
AU - Ackler, Harold D.
AU - Sammakia, Bahgat G.
PY - 2006
Y1 - 2006
N2 - This paper reports the current status of a novel MEMS based ultra-high density compliant interconnect technology that was proposed in the last Electronic Components and Technology Conference (ECTC) [1]. This MEMS-based interconnect, which we call Smart Three Axis Compliant (STAC) interconnects are directly fabricated onto electrical contact pads or thru-silicon vias on die at the wafer-level. These interconnects are initially bound to the die by a chemically soluble release layer. The "free" end of the interconnect is bonded to a contact pad on a package substrate or other die at the wafer level or die level, and the release layer is dissolved to free the interconnect from the substrate, thereby permitting it to accommodate relative displacements. The paper will clearly show successfully fabricated STAC interconnects at 50micron pitch on a silicon die bonded onto an ultra-thin glass die.
AB - This paper reports the current status of a novel MEMS based ultra-high density compliant interconnect technology that was proposed in the last Electronic Components and Technology Conference (ECTC) [1]. This MEMS-based interconnect, which we call Smart Three Axis Compliant (STAC) interconnects are directly fabricated onto electrical contact pads or thru-silicon vias on die at the wafer-level. These interconnects are initially bound to the die by a chemically soluble release layer. The "free" end of the interconnect is bonded to a contact pad on a package substrate or other die at the wafer level or die level, and the release layer is dissolved to free the interconnect from the substrate, thereby permitting it to accommodate relative displacements. The paper will clearly show successfully fabricated STAC interconnects at 50micron pitch on a silicon die bonded onto an ultra-thin glass die.
UR - http://www.scopus.com/inward/record.url?scp=33845579338&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2006.1645798
DO - 10.1109/ECTC.2006.1645798
M3 - Conference contribution
AN - SCOPUS:33845579338
SN - 1424401526
SN - 9781424401529
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1147
EP - 1153
BT - Proceedings - IEEE 56th Electronic Components and Technology Conference
T2 - IEEE 56th Electronic Components and Technology Conference
Y2 - 30 May 2006 through 2 June 2006
ER -