DSP see-through: Going beyond talk-through

Adrian Rothenbuhler; Cameron H.G. Wright; Thad B. Welch; Michael G. Morrow

doi:10.1109/ICASSP.2014.6853995

DSP see-through: Going beyond talk-through

Adrian Rothenbuhler, Cameron H.G. Wright, Thad B. Welch, Michael G. Morrow

Electrical Engineering Department

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5 Scopus citations

Abstract

Engineering educators have found that students making the transition to real-time digital signal processing (DSP) from the more comfortable world of off-line processing using MATLAB must establish confidence in the hardware and software platform before significant learning can begin. In the audio realm, a talk-through project accomplishes this. For moving on to a more complicated signal such as video, the authors propose the use of a see-through project. A description of a see-through project on a high-performance real-time DSP platform, and how this can lead to better follow-on learning, is provided.

Original language	English
Title of host publication	2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	2228-2232
Number of pages	5
ISBN (Print)	9781479928927
DOIs	https://doi.org/10.1109/ICASSP.2014.6853995
State	Published - 2014
Event	2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014 - Florence, Italy Duration: 4 May 2014 → 9 May 2014

Publication series

Name	ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings
ISSN (Print)	1520-6149

Conference

Conference	2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014
Country/Territory	Italy
City	Florence
Period	4/05/14 → 9/05/14

Keywords

digital signal processing
engineering education
video processing

Access to Document

10.1109/ICASSP.2014.6853995

Cite this

Rothenbuhler, A., Wright, C. H. G., Welch, T. B., & Morrow, M. G. (2014). DSP see-through: Going beyond talk-through. In 2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014 (pp. 2228-2232). Article 6853995 (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICASSP.2014.6853995

Rothenbuhler, Adrian ; Wright, Cameron H.G. ; Welch, Thad B. et al. / DSP see-through : Going beyond talk-through. 2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 2228-2232 (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings).

@inproceedings{27e9860a5a8646e39945cef6b6039de9,

title = "DSP see-through: Going beyond talk-through",

abstract = "Engineering educators have found that students making the transition to real-time digital signal processing (DSP) from the more comfortable world of off-line processing using MATLAB must establish confidence in the hardware and software platform before significant learning can begin. In the audio realm, a talk-through project accomplishes this. For moving on to a more complicated signal such as video, the authors propose the use of a see-through project. A description of a see-through project on a high-performance real-time DSP platform, and how this can lead to better follow-on learning, is provided.",

keywords = "digital signal processing, engineering education, video processing",

author = "Adrian Rothenbuhler and Wright, {Cameron H.G.} and Welch, {Thad B.} and Morrow, {Michael G.}",

year = "2014",

doi = "10.1109/ICASSP.2014.6853995",

language = "English",

isbn = "9781479928927",

series = "ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "2228--2232",

booktitle = "2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014",

note = "2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014 ; Conference date: 04-05-2014 Through 09-05-2014",

}

Rothenbuhler, A, Wright, CHG, Welch, TB & Morrow, MG 2014, DSP see-through: Going beyond talk-through. in 2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014., 6853995, ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 2228-2232, 2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014, Florence, Italy, 4/05/14. https://doi.org/10.1109/ICASSP.2014.6853995

DSP see-through: Going beyond talk-through. / Rothenbuhler, Adrian; Wright, Cameron H.G.; Welch, Thad B. et al.
2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 2228-2232 6853995 (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - DSP see-through

T2 - 2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014

AU - Rothenbuhler, Adrian

AU - Wright, Cameron H.G.

AU - Welch, Thad B.

AU - Morrow, Michael G.

PY - 2014

Y1 - 2014

N2 - Engineering educators have found that students making the transition to real-time digital signal processing (DSP) from the more comfortable world of off-line processing using MATLAB must establish confidence in the hardware and software platform before significant learning can begin. In the audio realm, a talk-through project accomplishes this. For moving on to a more complicated signal such as video, the authors propose the use of a see-through project. A description of a see-through project on a high-performance real-time DSP platform, and how this can lead to better follow-on learning, is provided.

AB - Engineering educators have found that students making the transition to real-time digital signal processing (DSP) from the more comfortable world of off-line processing using MATLAB must establish confidence in the hardware and software platform before significant learning can begin. In the audio realm, a talk-through project accomplishes this. For moving on to a more complicated signal such as video, the authors propose the use of a see-through project. A description of a see-through project on a high-performance real-time DSP platform, and how this can lead to better follow-on learning, is provided.

KW - digital signal processing

KW - engineering education

KW - video processing

UR - http://www.scopus.com/inward/record.url?scp=84905230319&partnerID=8YFLogxK

U2 - 10.1109/ICASSP.2014.6853995

DO - 10.1109/ICASSP.2014.6853995

M3 - Conference contribution

AN - SCOPUS:84905230319

SN - 9781479928927

T3 - ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings

SP - 2228

EP - 2232

BT - 2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014

PB - Institute of Electrical and Electronics Engineers Inc.

Y2 - 4 May 2014 through 9 May 2014

ER -

Rothenbuhler A, Wright CHG, Welch TB, Morrow MG. DSP see-through: Going beyond talk-through. In 2014 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 2228-2232. 6853995. (ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings). doi: 10.1109/ICASSP.2014.6853995

DSP see-through: Going beyond talk-through

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