Abstract
Grain boundary engineering, which increases the special boundary fraction, may improve microstructural stability during annealing. Different processing routes are undertaken to establish the effectiveness of each and to better understand which microstructural features determine the resulting stability. We find that multiple cycles of grain boundary engineering result in a material that resists abnormal grain growth better than other processing routes despite similarities in special boundary fraction, grain size, and general boundary connectivity among as-processed materials.
Original language | American English |
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Pages (from-to) | 88-91 |
Number of pages | 4 |
Journal | Scripta Materialia |
Volume | 61 |
Issue number | 1 |
DOIs | |
State | Published - Jul 2009 |
Keywords
- Abnormal grain growth
- Copper
- Grain boundary connectivity
- Grain boundary engineering
- Texture
EGS Disciplines
- Materials Science and Engineering