Effect of imidization temperature on the adhesion of polyimide on aluminum

Jyongsik Jang, Jeung Hoon Lee

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

Peel strength and lap shear strength between aluminum and polyimide were measured at different imidization temperatures. Polyimide was synthesized from 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and 4,4′-diaminophenylether (ODA). The interfacial adhesion between polyimide and aluminum shows a maximum value at the imidization temperature of 320°C. To relate the interfacial adhesion strength with chemical interaction between polyimide and aluminum, the Fourier transform infrared spectroscopy (FTIR) ATR technique was used. In addition, morphological studies on the peeled surfaces were also carried out.

Original languageEnglish
Pages (from-to)199-205
Number of pages7
JournalJournal of Applied Polymer Science
Volume62
Issue number1
DOIs
StatePublished - 3 Oct 1996

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