Effect of imidization temperature on the adhesion of polyimide on aluminum

Jyongsik Jang; Jeung Hoon Lee

doi:10.1002/(sici)1097-4628(19961003)62:1<199::aid-app23>3.0.co;2-%23

Effect of imidization temperature on the adhesion of polyimide on aluminum

Jyongsik Jang
, Jeung Hoon Lee

Chemistry Department

Seoul National University

Research output: Contribution to journal › Article › peer-review

Abstract

Peel strength and lap shear strength between aluminum and polyimide were measured at different imidization temperatures. Polyimide was synthesized from 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and 4,4′-diaminophenylether (ODA). The interfacial adhesion between polyimide and aluminum shows a maximum value at the imidization temperature of 320°C. To relate the intefacial adhesion strength with chemical interaction between polyimide and aluminum, the Fourier transform infrared spectroscopy (FTIR) ATR technique was used. In addition, morphological studies on the peeled surfaces were also carried out.

Original language	English
Pages (from-to)	199-205
Number of pages	7
Journal	Journal of Applied Polymer Science
Volume	62
Issue number	1
DOIs	https://doi.org/10.1002/(sici)1097-4628(19961003)62:1<199::aid-app23>3.0.co;2-%23
State	Published - 3 Oct 1996

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10.1002/(sici)1097-4628(19961003)62:1<199::aid-app23>3.0.co;2-%23

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title = "Effect of imidization temperature on the adhesion of polyimide on aluminum",

abstract = "Peel strength and lap shear strength between aluminum and polyimide were measured at different imidization temperatures. Polyimide was synthesized from 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and 4,4′-diaminophenylether (ODA). The interfacial adhesion between polyimide and aluminum shows a maximum value at the imidization temperature of 320°C. To relate the intefacial adhesion strength with chemical interaction between polyimide and aluminum, the Fourier transform infrared spectroscopy (FTIR) ATR technique was used. In addition, morphological studies on the peeled surfaces were also carried out.",

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N2 - Peel strength and lap shear strength between aluminum and polyimide were measured at different imidization temperatures. Polyimide was synthesized from 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and 4,4′-diaminophenylether (ODA). The interfacial adhesion between polyimide and aluminum shows a maximum value at the imidization temperature of 320°C. To relate the intefacial adhesion strength with chemical interaction between polyimide and aluminum, the Fourier transform infrared spectroscopy (FTIR) ATR technique was used. In addition, morphological studies on the peeled surfaces were also carried out.

AB - Peel strength and lap shear strength between aluminum and polyimide were measured at different imidization temperatures. Polyimide was synthesized from 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) and 4,4′-diaminophenylether (ODA). The interfacial adhesion between polyimide and aluminum shows a maximum value at the imidization temperature of 320°C. To relate the intefacial adhesion strength with chemical interaction between polyimide and aluminum, the Fourier transform infrared spectroscopy (FTIR) ATR technique was used. In addition, morphological studies on the peeled surfaces were also carried out.

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U2 - 10.1002/(sici)1097-4628(19961003)62:1<199::aid-app23>3.0.co;2-%23

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VL - 62

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JO - Journal of Applied Polymer Science

JF - Journal of Applied Polymer Science

IS - 1

ER -

Effect of imidization temperature on the adhesion of polyimide on aluminum

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