Electroless Plating of Copper on Laser‐Induced Graphene for Flexible Hybrid Electronic Applications (Adv. Mater. Technol. 9/2025)

Attila Rektor; Josh Eixenberger; Tony Valayil Varghese; Brian Cummings; Michael Curtis; Nicholas Mckibben; John Timler; David Estrada

doi:10.1002/admt.202570046

Electroless Plating of Copper on Laser‐Induced Graphene for Flexible Hybrid Electronic Applications (Adv. Mater. Technol. 9/2025)

Attila Rektor
, Josh Eixenberger
, Tony Valayil Varghese
, Brian Cummings
, Michael Curtis
, Nicholas Mckibben
, John Timler
, David Estrada

Boise State University
Science Applications International Corporation

Research output: Contribution to journal › Article › peer-review

Abstract

In article number 2401901, David Estrada and co-workers demonstrate a new approach to flexible PCB manufacturing. Through the use of Pd nanoparticle catalysts embedded in laser-induced graphene, the electroless plating of copper traces enables a simple and innovative approach to advance flexible hybrid electronics research and manufacturing processes. Image credit: Alex Jerez, Scientific Illustrator.

Original language	English
Journal	Advanced Materials Technologies
Volume	10
Issue number	9
DOIs	https://doi.org/10.1002/admt.202570046
State	Published - 6 May 2025

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title = "Electroless Plating of Copper on Laser‐Induced Graphene for Flexible Hybrid Electronic Applications (Adv. Mater. Technol. 9/2025)",

abstract = "In article number 2401901, David Estrada and co-workers demonstrate a new approach to flexible PCB manufacturing. Through the use of Pd nanoparticle catalysts embedded in laser-induced graphene, the electroless plating of copper traces enables a simple and innovative approach to advance flexible hybrid electronics research and manufacturing processes. Image credit: Alex Jerez, Scientific Illustrator.",

author = "Attila Rektor and Josh Eixenberger and \{Valayil Varghese\}, Tony and Brian Cummings and Michael Curtis and Nicholas Mckibben and John Timler and David Estrada",

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AU - Rektor, Attila

AU - Eixenberger, Josh

AU - Valayil Varghese, Tony

AU - Cummings, Brian

AU - Curtis, Michael

AU - Mckibben, Nicholas

AU - Timler, John

AU - Estrada, David

PY - 2025/5/6

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AB - In article number 2401901, David Estrada and co-workers demonstrate a new approach to flexible PCB manufacturing. Through the use of Pd nanoparticle catalysts embedded in laser-induced graphene, the electroless plating of copper traces enables a simple and innovative approach to advance flexible hybrid electronics research and manufacturing processes. Image credit: Alex Jerez, Scientific Illustrator.

U2 - 10.1002/admt.202570046

DO - 10.1002/admt.202570046

M3 - Article

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JO - Advanced Materials Technologies

JF - Advanced Materials Technologies

IS - 9

ER -

Electroless Plating of Copper on Laser‐Induced Graphene for Flexible Hybrid Electronic Applications (Adv. Mater. Technol. 9/2025)

Abstract

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