Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780))

Parthiban Arunasalam; Harold D. Ackler; Bahgat G. Sammakia

doi:10.1116/1.2434021

Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780))

Parthiban Arunasalam, Harold D. Ackler, Bahgat G. Sammakia

Micron School of Materials Science and Engineering

State University of New York Binghamton University

Research output: Contribution to journal › Comment/debate

Original language	English
Pages (from-to)	292
Number of pages	1
Journal	Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume	25
Issue number	1
DOIs	https://doi.org/10.1116/1.2434021
State	Published - 2007

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Arunasalam, P., Ackler, H. D., & Sammakia, B. G. (2007). Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780)). Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 25(1), 292. https://doi.org/10.1116/1.2434021

Arunasalam, Parthiban ; Ackler, Harold D. ; Sammakia, Bahgat G. / Erratum : Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780)). In: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 2007 ; Vol. 25, No. 1. pp. 292.

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title = "Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780))",

author = "Parthiban Arunasalam and Ackler, {Harold D.} and Sammakia, {Bahgat G.}",

year = "2007",

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Arunasalam, P, Ackler, HD & Sammakia, BG 2007, 'Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780))', Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, vol. 25, no. 1, pp. 292. https://doi.org/10.1116/1.2434021

Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780)). / Arunasalam, Parthiban; Ackler, Harold D.; Sammakia, Bahgat G.
In: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, Vol. 25, No. 1, 2007, p. 292.

Research output: Contribution to journal › Comment/debate

TY - JOUR

T1 - Erratum

T2 - Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780))

AU - Arunasalam, Parthiban

AU - Ackler, Harold D.

AU - Sammakia, Bahgat G.

PY - 2007

Y1 - 2007

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U2 - 10.1116/1.2434021

DO - 10.1116/1.2434021

M3 - Comment/debate

AN - SCOPUS:34047163177

SN - 1071-1023

VL - 25

SP - 292

JO - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

JF - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

IS - 1

ER -

Arunasalam P, Ackler HD, Sammakia BG. Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780)). Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 2007;25(1):292. doi: 10.1116/1.2434021

Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780))

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