Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780))

Parthiban Arunasalam; Harold D. Ackler; Bahgat G. Sammakia

doi:10.1116/1.2434021

Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780))

Parthiban Arunasalam
, Harold D. Ackler
, Bahgat G. Sammakia

Micron School of Materials Science and Engineering

State University of New York Binghamton University

Research output: Contribution to journal › Comment/debate

Original language	English
Pages (from-to)	292
Number of pages	1
Journal	Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume	25
Issue number	1
DOIs	https://doi.org/10.1116/1.2434021
State	Published - 2007

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Arunasalam, P., Ackler, H. D., & Sammakia, B. G. (2007). Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780)). Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 25(1), 292. https://doi.org/10.1116/1.2434021

Arunasalam, Parthiban ; Ackler, Harold D. ; Sammakia, Bahgat G. / Erratum : Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780)). In: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 2007 ; Vol. 25, No. 1. pp. 292.

@article{28e9719d636449cf8720ff61075c70c8,

title = "Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780))",

author = "Parthiban Arunasalam and Ackler, \{Harold D.\} and Sammakia, \{Bahgat G.\}",

year = "2007",

doi = "10.1116/1.2434021",

language = "English",

volume = "25",

pages = "292",

number = "1",

}

Arunasalam, P, Ackler, HD & Sammakia, BG 2007, 'Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780))', Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, vol. 25, no. 1, pp. 292. https://doi.org/10.1116/1.2434021

Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780)). / Arunasalam, Parthiban; Ackler, Harold D.; Sammakia, Bahgat G.
In: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, Vol. 25, No. 1, 2007, p. 292.

Research output: Contribution to journal › Comment/debate

TY - JOUR

T1 - Erratum

T2 - Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780))

AU - Arunasalam, Parthiban

AU - Ackler, Harold D.

AU - Sammakia, Bahgat G.

PY - 2007

Y1 - 2007

UR - https://www.scopus.com/pages/publications/34047163177

U2 - 10.1116/1.2434021

DO - 10.1116/1.2434021

M3 - Comment/debate

AN - SCOPUS:34047163177

SN - 1071-1023

VL - 25

SP - 292

JO - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

JF - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

IS - 1

ER -

Arunasalam P, Ackler HD, Sammakia BG. Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780)). Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 2007;25(1):292. doi: 10.1116/1.2434021

Erratum: Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks (Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures (2006) 24 (1780))

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