Experimental micromechanics study of lamellar TiAl

Fu Pen Chiang, Gunes Uzer, Yi Ding, Andrew H. Rosenberger

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A unique micro-scale full field deformation measurement technique called electron speckle photography is exploited to investigate the deformation mechanism of lamellar TiAl. We find the size of the specimen used and the area of strain measurement affect the mechanical properties thus obtained. The strain distribution inside a grain is highly heterogeneous. The grain boundary is much stiffer than the interior of the grain. We also observe several interesting phenomena of the material when a crack is present. Crack speed tends to slow down when the crack approaches a grain boundary. Within a grain the slowest propagation speed is when the lamellar layers are perpendicular to the crack. Crack may jump across a grain boundary and its propagation direction may be predicted by the strain concentration congregated near the grain boundary. By mapping the deformation field surrounding the crack tip, we can evaluate the mode mixity from the speckle results at different stages of crack propagation.

Original languageEnglish
Title of host publicationMaterials Processing and Manufacturing Division Symposium
Subtitle of host publicationMechanics and Materials Modeling and Materials Design Methodologies - Proceedings of Symposium held during the 2007 TMS Annual Meeting
Pages37-47
Number of pages11
StatePublished - 2007
Event136th TMS Annual Meeting, 2007 - Orlando, FL, United States
Duration: 25 Feb 20071 Mar 2007

Publication series

NameTMS Annual Meeting

Conference

Conference136th TMS Annual Meeting, 2007
Country/TerritoryUnited States
CityOrlando, FL
Period25/02/071/03/07

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