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High field breakdown of carbon nanotube network transistors

  • Man Prakash Gupta
  • , Ashkan Behnam
  • , David Estrada
  • , Eric Pop
  • , Satish Kumar
  • Georgia Institute of Technology
  • University of Illinois at Urbana-Champaign

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

We develop and employ a self-consistent electro-thermal model to study the high field breakdown of carbon nanotube (CNT) network thin film transistors (CN-TFTs). We investigate the effects of the CNT alignment angle and length distribution on the breakdown process caused by excessive self-heating. We examine relevant breakdown characteristics such as the peak current and corresponding voltage and power in relation to these two network parameters. We find that the breakdown behavior can significantly vary with respect to the CNT length and alignment distribution even when the network density is kept the same. Results suggest that an optimum alignment (∼ 65°) can be found for a network with constant CNT lengths to obtain higher current/power without setting off an early breakdown. When both CNT length and alignment angle are varied, we find that networks with higher average CNT length have lower optimum alignment such that doubling the average CNT length lowers the optimum alignment angle by half. Therefore these network parameters need to be carefully selected to achieve greater thermal reliability and higher electrical performance.

Original languageEnglish
Title of host publicationASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOIs
StatePublished - 2013
EventASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States
Duration: 16 Jul 201318 Jul 2013

Publication series

NameASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Volume1

Conference

ConferenceASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Country/TerritoryUnited States
CityBurlingame, CA
Period16/07/1318/07/13

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