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Investigation of tunneling current in SiO2/HfO2 gate stacks for flash memory applications

  • Bhaswar Chakrabarti
  • , Heesoo Kang
  • , Barry Brennan
  • , Tae Joo Park
  • , Kurtis D. Cantley
  • , Adam Pirkle
  • , Stephen McDonnell
  • , Jiyoung Kim
  • , Robert M. Wallace
  • , Eric M. Vogel
  • University of Texas at Dallas
  • Samsung
  • Hanyang University
  • Intel
  • Georgia Institute of Technology

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

Despite theoretical predictions of significant performance improvement in Flash memory devices using tunnel-barrier-engineered (TBE) structures, there have been very few reports that demonstrate experimental verification. In this work, we have studied the role of factors such as high-k layer thickness and annealing recipe on the performance of SiO2/HfO2 gate stacks by electrical and physical characterization techniques. Results indicate that thick HfO2 is not suitable for use in SiO2/HfO 2 stacks for tunnel barrier engineering applications. The performance of SiO2/HfO2 stacks improves with decreasing thickness of the HfO2 layer. Mild (10%) O2/N2 anneals do not significantly affect performance, although annealing above 600 °C resulted in a slight decrease in the program current. Based on our observations, we propose a method to improve the program current in these structures and a simple hypothesis for the physical model for tunneling in SiO 2/HfO2 stacks.

Original languageEnglish
Article number6062399
Pages (from-to)4189-4195
Number of pages7
JournalIEEE Transactions on Electron Devices
Volume58
Issue number12
DOIs
StatePublished - Dec 2011

Keywords

  • Charge traps
  • Fowler-Nordheim (F-N) tunneling
  • high-k dielectric
  • tunnel barrier engineering
  • high-$k$ dielectric

EGS Disciplines

  • Electrical and Computer Engineering

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