Abstract
Despite theoretical predictions of significant performance improvement in Flash memory devices using tunnel-barrier-engineered (TBE) structures, there have been very few reports that demonstrate experimental verification. In this work, we have studied the role of factors such as high-k layer thickness and annealing recipe on the performance of SiO2/HfO2 gate stacks by electrical and physical characterization techniques. Results indicate that thick HfO2 is not suitable for use in SiO2/HfO 2 stacks for tunnel barrier engineering applications. The performance of SiO2/HfO2 stacks improves with decreasing thickness of the HfO2 layer. Mild (10%) O2/N2 anneals do not significantly affect performance, although annealing above 600 °C resulted in a slight decrease in the program current. Based on our observations, we propose a method to improve the program current in these structures and a simple hypothesis for the physical model for tunneling in SiO 2/HfO2 stacks.
| Original language | English |
|---|---|
| Article number | 6062399 |
| Pages (from-to) | 4189-4195 |
| Number of pages | 7 |
| Journal | IEEE Transactions on Electron Devices |
| Volume | 58 |
| Issue number | 12 |
| DOIs | |
| State | Published - Dec 2011 |
Keywords
- Charge traps
- Fowler-Nordheim (F-N) tunneling
- high-k dielectric
- tunnel barrier engineering
- high-$k$ dielectric
EGS Disciplines
- Electrical and Computer Engineering
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