Limitations of Poole–Frenkel Conduction in Bilayer HfO2/SiO2 MOS Devices

Richard G. Southwick, Justin Reed, Christopher Buu, Ross Butler, Gennadi Bersuker, William B. Knowlton

Research output: Contribution to journalArticlepeer-review

52 Scopus citations

Abstract

The gate leakage current of metaloxidesemiconductors (MOSs) composed of hafnium oxide $(\hbox{HfO}-{2})$ exhibits temperature dependence, which is usually attributed to the standard PooleFrenkel (PF) transport model. However, the reported magnitudes of the trap barrier height vary significantly. This paper explores the fundamental challenges associated with applying the PF model to describe transport in $\hbox{HfO}-{2}/ \hbox{SiO}-{2}$ bilayers in n/p MOS field-effect transistors composed of 3- and 5-nm $\hbox{HfO}-{2}$ on 1.1-nm $ \hbox{SiO}-{2}$ dielectric stacks. The extracted PF trap barrier height is shown to be dependent on several variables including the following: the temperature range, method of calculating the electric field, electric-field range considered, and $\hbox{HfO}-{2}$ thickness. PF conduction provides a consistent description of the gate leakage current only within a limited range of the current values while failing to explain the temperature dependence of the 3-nm $\hbox{HfO}-{2}$ stacks for gate voltages of less than 1 V, leaving other possible temperature-dependent mechanisms to be explored.

Original languageAmerican English
Article number5361329
Pages (from-to)201-207
Number of pages7
JournalIEEE Transactions on Device and Materials Reliability
Volume10
Issue number2
DOIs
StatePublished - Jun 2010

Keywords

  • Cryogenic
  • Hafnium oxide (HfO2)
  • High-k dielectric
  • Metal-oxide-semiconductors (MOS)
  • Poole-Frenkel (P-F).
  • Terms-Carrier transport

EGS Disciplines

  • Materials Science and Engineering

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