Abstract
Low temperature co-fired ceramic (LTCC) is a packaging material that has a strong resistance to high temperatures and harsh chemical environments. It is capable of creating a fully hermetic seal around any embedded circuitry, which makes it an ideal material for use in high temperature vacuum applications. However, the conductive pastes designed to be cofired with the LTCC are not rated for high temperature (up to 400°C) in a vacuum, so they are not suitable for designs that require conductors to be exposed to the external environment. The primary solution to this problem is the implementation of specialized conductive materials and sealants, but the use of these materials required the development of a new fabrication process because they are not designed to be directly compatible with LTCC.
| Original language | American English |
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| State | Published - 21 Apr 2023 |
| Event | 2023 Undergraduate Research Showcase - Boise State University, Boise, United States Duration: 21 Apr 2023 → … https://scholarworks.boisestate.edu/under_showcase_2023 |
Conference
| Conference | 2023 Undergraduate Research Showcase |
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| Abbreviated title | 2023 URS |
| Country/Territory | United States |
| City | Boise |
| Period | 21/04/23 → … |
| Internet address |