Abstract
The current focus for micro-electromechanical (MEMSs) fabrication is based on the use of Si as the primary material. Great progress has been made due to the extensive processing knowledge in the semiconductor device industry. However Si based devices have some limitations. Few materials can be integrated into standard IC processing techniques. Multilayer ceramic packaging technology such as low temperature co-fired ceramic materials hold considerable promise as a platform for MEMs devices. In the Ceramic MEMs lab at Boise State University we are using the LTCC system to build various devices including a simple pressure sensor and an ion mobility spectrometer (IMS). Designs have also been generated for a micro-combustor, micro-propulsion and micro analytical tools.
| Original language | English |
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| Pages | 290-300 |
| Number of pages | 11 |
| State | Published - 2003 |
| Externally published | Yes |
| Event | Low Temperature Electronics and Low Temperature Cofired Ceramic Based Electronic Devices - Orlando, FL, United States Duration: 12 Oct 2003 → 16 Oct 2003 |
Conference
| Conference | Low Temperature Electronics and Low Temperature Cofired Ceramic Based Electronic Devices |
|---|---|
| Country/Territory | United States |
| City | Orlando, FL |
| Period | 12/10/03 → 16/10/03 |