Fingerprint
Dive into the research topics of 'Microstructural Modification of Thick Copper Films to Optimize Chemical-Mechanical Planarization of Through-Wafer Interconnects'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Microstructural Modification of Thick Copper Films to Optimize Chemical-Mechanical Planarization of Through-Wafer Interconnects
Patrick Andersen, Mariela Bentancur, Megan Frary
Research output: Contribution to conference › Presentation