Microsystems and microfluidics: Why not LTCC?

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

8 Scopus citations

Abstract

Microsystem and microfluidic devices are starting to find their way into the marketplace. Several different materials systems compete for fabrication of these devices. Although many advantages exist for the use of LTCC in these types of applications, the products that have come to market are fabricated in polymer materials or glass. It is not clear why these materials are preferred for manufacturing. The challenges in using LTCC for commercial microfluidic devices are discussed.

Original languageEnglish
Title of host publicationInternational Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
Pages9-12
Number of pages4
StatePublished - 2007
Event3rd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007 - Denver, CO, United States
Duration: 23 Apr 200726 Apr 2007

Publication series

NameInternational Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007

Conference

Conference3rd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
Country/TerritoryUnited States
CityDenver, CO
Period23/04/0726/04/07

Keywords

  • Lab on a chip
  • Low Temperature Co-Fired Ceramics (LTCC)
  • Microanalytical systems
  • Microfluidics

Fingerprint

Dive into the research topics of 'Microsystems and microfluidics: Why not LTCC?'. Together they form a unique fingerprint.

Cite this