Abstract
Ni-Mn-Ga thin films are promising candidates for MicroElectroMechanical Systems. Triple-layers of nickel, manganese, and gallium were electrodeposited from chemical solutions on to tungsten and molybdenum refractory metal substrates. These layered films were subsequently annealed at 800 to 900 °C to form a Ni-Mn-Ga Heusler alloy by diffusion. To evaluate the quality of the film, the magnetization of the Ni-Mn-Ga film was measured and normalized by the magnetization of nickel, yielding the relative magnetization. Due to the formation of Ni-Mn-Ga during annealing, the relative magnetization was approximately 2 times larger than the tri-layered as-plated film. These results are comparable to bulk Ni-Mn-Ga reference samples. X-ray diffraction measurements confirmed that the material was present as a mixture of L21-ordered austenite as well as modulated 10 M and non modulated martensite with manganese oxide impurities.
| Original language | American English |
|---|---|
| Pages (from-to) | 171-174 |
| Number of pages | 4 |
| Journal | Thin Solid Films |
| Volume | 522 |
| DOIs | |
| State | Published - 1 Nov 2012 |
Keywords
- Electrodeposition
- Magnetic shape memory
- Magnetization
- Ni-Mn-Ga
EGS Disciplines
- Materials Science and Engineering