On the nature of ultra-thin gate oxide degradation during pulse stressing of nMOSCAPs

William B. Knowlton, Santosh Kumar, Theodora Caldwell, Jose J. Gomez, Betsy Cheek

Research output: Contribution to conferencePaperpeer-review

4 Scopus citations

Abstract

Preliminary Pulse (dynamic) stress testing (PVS) results performed in accumulation indicate that degradation and breakdown mechanisms occur such as stress induced leakage current (SILC) and hard breakdown (HBD) as previously reported. Additional degradation and breakdown mechanisms due to PVS were observed for the first time such as soft breakdown (SBD), limited hard breakdown (LHBD) and moderate breakdown (MBD). Finally, post-PVS induced LHBD I-V measurements show the leakage current in accumulation is more than 5 orders of magnitude greater than in inversion at similar voltages.

Original languageEnglish
Pages87-88
Number of pages2
StatePublished - 2001
Event2001 IEEE International Integrated Reliability Workshop Final Report - Lake Tahoe, CA, United States
Duration: 15 Oct 200118 Oct 2001

Conference

Conference2001 IEEE International Integrated Reliability Workshop Final Report
Country/TerritoryUnited States
CityLake Tahoe, CA
Period15/10/0118/10/01

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