Optimization of Bosch etch process for through wafer interconnects

Linda Kenoyer, Rex Oxford, Amy Moll

Research output: Contribution to journalConference articlepeer-review

10 Scopus citations

Abstract

The Bosch etch process1 was utilized to create 50 micrometer vias with an aspect ration of 10:1 in silicon wafers for through wafer interconnects. The process is complex with twenty-two separate parameters required to control the process. Deviating from the standard process and flowing SF6 during the deposition process resulted in a more stable and reproducible process.

Original languageEnglish
Pages (from-to)338-339
Number of pages2
JournalBiennial University/Government/Industry Microelectronics Symposium - Proceedings
StatePublished - 2003
Event15th Biennial University/Government/Industry Microelectronics Symposium - Boise, ID, United States
Duration: 30 Jun 20032 Jul 2003

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