@inbook{9cb27a705956488eb54fff39b2ef1136,
title = "PCM design issues",
abstract = "This chapter presents the common design challenges of using PCMs. Issues with containment in the melt phase are discussed, with several different possible solutions presented. These include simple box containment, flexible films, shape-stabilization and microencapsulation. Methods to improve thermal conductivity and thermal diffusivity are discussed and techniques ranging from embedded heat sinks to the use of suspended nanoparticles are reviewed with advantages and challenges in each case discussed.",
keywords = "Microencapsulated PCM, Nano-enhanced PCM, NanoPCM, PCM containment, PCM design, PCM thermal conductivity, Shape-stabilized PCM",
author = "Fleischer, {Amy S.}",
note = "Publisher Copyright: {\textcopyright} 2015, The Author(s).",
year = "2015",
doi = "10.1007/978-3-319-20922-7_4",
language = "English",
series = "SpringerBriefs in Applied Sciences and Technology",
publisher = "Springer Verlag",
number = "9783319209210",
pages = "49--73",
booktitle = "SpringerBriefs in Applied Sciences and Technology",
address = "Germany",
edition = "9783319209210",
}