TY - GEN
T1 - Post-bonding and fabrication of low temperature co-fired ceramic
AU - Weston, H.
AU - Plumlee, D. G.
AU - Moll, A. J.
PY - 2007
Y1 - 2007
N2 - The development of an Ion Mobility Spectrometer (IMS) drift tube fabricated in low temperature co-fired ceramics has driven the need to develop a process for bonding post fired LTCC pieces. As originally designed, the drift tube for the (IMS) device required that more than 200 layers of LTCC to be fired jointly and electrical connections to be made on each layer. To improve yield, a process to bond and electrically connect fired pieces of LTCC was developed. A glass encapsulant paste was used for the bonding and the electrical connections were made with conductive paste. This glass encapsulate process could also be used to embed other elements inside of cavities, bonding of very small systems, and to improve the development of other devices.
AB - The development of an Ion Mobility Spectrometer (IMS) drift tube fabricated in low temperature co-fired ceramics has driven the need to develop a process for bonding post fired LTCC pieces. As originally designed, the drift tube for the (IMS) device required that more than 200 layers of LTCC to be fired jointly and electrical connections to be made on each layer. To improve yield, a process to bond and electrically connect fired pieces of LTCC was developed. A glass encapsulant paste was used for the bonding and the electrical connections were made with conductive paste. This glass encapsulate process could also be used to embed other elements inside of cavities, bonding of very small systems, and to improve the development of other devices.
KW - Fabrication techniques
KW - Glass encapsulant paste (QQ550)
KW - Ion mobility spectrometer (IMS)
KW - Low temperature co-fired ceramics (LTCC)
UR - https://www.scopus.com/pages/publications/84878254015
M3 - Conference contribution
AN - SCOPUS:84878254015
SN - 9781605603872
T3 - International Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
SP - 320
EP - 323
BT - International Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
T2 - 3rd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
Y2 - 23 April 2007 through 26 April 2007
ER -