Recent Advances in High Density Area Array Interconnect Bonding for 3D Integration

J. M. Lannon, J.; C. Gregory; M. Lueck; A. Huffman; D. Temple; Amy J. Moll; William B. Knowlton

Recent Advances in High Density Area Array Interconnect Bonding for 3D Integration

J. M. Lannon, J., C. Gregory, M. Lueck, A. Huffman, D. Temple, Amy J. Moll, William B. Knowlton

Micron School of Materials Science and Engineering

RTI International

Research output: Contribution to journal › Article › peer-review

Original language	American English
Journal	Proceedings of SPIE
Volume	7663
State	Published - 1 Apr 2010

Keywords

3-D integration
IC stacking
high density area arrays

EGS Disciplines

Materials Science and Engineering

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Recent Advances in High Density Area Array Interconnect Bonding fFinal published version, 374 KBLicense: Unspecified
Recent Advances in High Density Area Array Interconnect Bonding fFinal published version, 374 KBLicense: Unspecified

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@article{28cb0a6f1d1947cc90250a358fa9414b,

title = "Recent Advances in High Density Area Array Interconnect Bonding for 3D Integration",

keywords = "3-D integration, IC stacking, high density area arrays",

author = "{Lannon, J.}, {J. M.} and C. Gregory and M. Lueck and A. Huffman and D. Temple and Moll, {Amy J.} and Knowlton, {William B.}",

year = "2010",

month = apr,

day = "1",

language = "American English",

volume = "7663",

}

TY - JOUR

T1 - Recent Advances in High Density Area Array Interconnect Bonding for 3D Integration

AU - Lannon, J., J. M.

AU - Gregory, C.

AU - Lueck, M.

AU - Huffman, A.

AU - Temple, D.

AU - Moll, Amy J.

AU - Knowlton, William B.

PY - 2010/4/1

Y1 - 2010/4/1

KW - 3-D integration

KW - IC stacking

KW - high density area arrays

UR - https://scholarworks.boisestate.edu/mse_facpubs/8

UR - http://scholarworks.boisestate.edu/cgi/viewcontent.cgi?article=1007&context=mse_facpubs

M3 - Article

VL - 7663

JO - Proceedings of SPIE

JF - Proceedings of SPIE

ER -

Recent Advances in High Density Area Array Interconnect Bonding for 3D Integration

Keywords

EGS Disciplines

Access to Document

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