Recent Advances in High Density Area Array Interconnect Bonding for 3D Integration

J. M. Lannon, J.; C. Gregory; M. Lueck; A. Huffman; D. Temple; Amy J. Moll; William B. Knowlton

doi:10.1117/12.850305

Recent Advances in High Density Area Array Interconnect Bonding for 3D Integration

J. M. Lannon, J., C. Gregory, M. Lueck, A. Huffman, D. Temple, Amy J. Moll, William B. Knowlton

RTI International

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

2 Downloads (Pure)

Abstract

The demand for more complex and multifunctional microsystems with enhanced performance characteristics for military applications is driving the electronics industry toward the use of best-of-breed materials and device technologies. Threedimensional (3-D) integration provides a way to build complex microsystems through bonding and interconnection of individually optimized device layers without compromising system performance and fabrication yield. Bonding of device layers can be achieved through polymer bonding or metal-metal interconnect bonding with a number of metalmetal systems. RTI has been investigating and characterizing Cu-Cu and Cu/Sn-Cu processes for high density area array imaging applications, demonstrating high yield bonding between sub-15 μm pads on large area array configurations. This paper will review recent advances in the development of high yield, large area array metal-metal interconnects which enable 3-D integration of heterogeneous materials (e.g. HgCdTe with silicon) and heterogeneous fabrication processes (e.g. infrared emitters or microbolometers with ICs) for imaging and scene projector applications.

Original language	American English
Title of host publication	Proceedings Volume 7663, Technologies for Synthetic Environments
Subtitle of host publication	Hardware-in-the-Loop Testing XV; 766305 (2010)
Volume	7663
DOIs	https://doi.org/10.1117/12.850305
State	Published - 1 Apr 2010
Event	Technologies for Synthetic Environments: Hardware-in-the-Loop Testing XV - Orlando, FL, United States Duration: 7 Apr 2010 → 8 Apr 2010

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Volume	7663
ISSN (Print)	0277-786X

Conference

Conference	Technologies for Synthetic Environments: Hardware-in-the-Loop Testing XV
Country/Territory	United States
City	Orlando, FL
Period	7/04/10 → 8/04/10

Keywords

3-D integration
high density area arrays
IC stacking
IR detector arrays
IR emitters
microbolometers

EGS Disciplines

Materials Science and Engineering

Access to Document

10.1117/12.850305

Recent Advances in High Density Area Array Interconnect Bonding fFinal published version, 374 KBLicense: Unspecified

Cite this

Lannon, J., J. M., Gregory, C., Lueck, M., Huffman, A., Temple, D., Moll, A. J., & Knowlton, W. B. (2010). Recent Advances in High Density Area Array Interconnect Bonding for 3D Integration. In Proceedings Volume 7663, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing XV; 766305 (2010) (Vol. 7663). Article 766305 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 7663). https://doi.org/10.1117/12.850305

@inproceedings{28cb0a6f1d1947cc90250a358fa9414b,

title = "Recent Advances in High Density Area Array Interconnect Bonding for 3D Integration",

abstract = "The demand for more complex and multifunctional microsystems with enhanced performance characteristics for military applications is driving the electronics industry toward the use of best-of-breed materials and device technologies. Threedimensional (3-D) integration provides a way to build complex microsystems through bonding and interconnection of individually optimized device layers without compromising system performance and fabrication yield. Bonding of device layers can be achieved through polymer bonding or metal-metal interconnect bonding with a number of metalmetal systems. RTI has been investigating and characterizing Cu-Cu and Cu/Sn-Cu processes for high density area array imaging applications, demonstrating high yield bonding between sub-15 μm pads on large area array configurations. This paper will review recent advances in the development of high yield, large area array metal-metal interconnects which enable 3-D integration of heterogeneous materials (e.g. HgCdTe with silicon) and heterogeneous fabrication processes (e.g. infrared emitters or microbolometers with ICs) for imaging and scene projector applications.",

keywords = "3-D integration, high density area arrays, IC stacking, IR detector arrays, IR emitters, microbolometers",

author = "\{Lannon, J.\}, \{J. M.\} and C. Gregory and M. Lueck and A. Huffman and D. Temple and Moll, \{Amy J.\} and Knowlton, \{William B.\}",

year = "2010",

month = apr,

day = "1",

doi = "10.1117/12.850305",

language = "American English",

isbn = "9780819481276",

volume = "7663",

series = "Proceedings of SPIE - The International Society for Optical Engineering",

booktitle = "Proceedings Volume 7663, Technologies for Synthetic Environments",

note = "Technologies for Synthetic Environments: Hardware-in-the-Loop Testing XV ; Conference date: 07-04-2010 Through 08-04-2010",

}

Lannon, J., JM, Gregory, C, Lueck, M, Huffman, A, Temple, D, Moll, AJ & Knowlton, WB 2010, Recent Advances in High Density Area Array Interconnect Bonding for 3D Integration. in Proceedings Volume 7663, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing XV; 766305 (2010). vol. 7663, 766305, Proceedings of SPIE - The International Society for Optical Engineering, vol. 7663, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing XV, Orlando, FL, United States, 7/04/10. https://doi.org/10.1117/12.850305

Recent Advances in High Density Area Array Interconnect Bonding for 3D Integration. / Lannon, J., J. M.; Gregory, C.; Lueck, M. et al.
Proceedings Volume 7663, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing XV; 766305 (2010). Vol. 7663 2010. 766305 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 7663).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Temple, D.

AU - Moll, Amy J.

AU - Knowlton, William B.

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AB - The demand for more complex and multifunctional microsystems with enhanced performance characteristics for military applications is driving the electronics industry toward the use of best-of-breed materials and device technologies. Threedimensional (3-D) integration provides a way to build complex microsystems through bonding and interconnection of individually optimized device layers without compromising system performance and fabrication yield. Bonding of device layers can be achieved through polymer bonding or metal-metal interconnect bonding with a number of metalmetal systems. RTI has been investigating and characterizing Cu-Cu and Cu/Sn-Cu processes for high density area array imaging applications, demonstrating high yield bonding between sub-15 μm pads on large area array configurations. This paper will review recent advances in the development of high yield, large area array metal-metal interconnects which enable 3-D integration of heterogeneous materials (e.g. HgCdTe with silicon) and heterogeneous fabrication processes (e.g. infrared emitters or microbolometers with ICs) for imaging and scene projector applications.

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KW - high density area arrays

KW - IC stacking

KW - IR detector arrays

KW - IR emitters

KW - microbolometers

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SN - 9780819481276

VL - 7663

T3 - Proceedings of SPIE - The International Society for Optical Engineering

BT - Proceedings Volume 7663, Technologies for Synthetic Environments

T2 - Technologies for Synthetic Environments: Hardware-in-the-Loop Testing XV

Y2 - 7 April 2010 through 8 April 2010

ER -

Lannon, J. JM, Gregory C, Lueck M, Huffman A, Temple D, Moll AJ et al. Recent Advances in High Density Area Array Interconnect Bonding for 3D Integration. In Proceedings Volume 7663, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing XV; 766305 (2010). Vol. 7663. 2010. 766305. (Proceedings of SPIE - The International Society for Optical Engineering). doi: 10.1117/12.850305

Recent Advances in High Density Area Array Interconnect Bonding for 3D Integration

Abstract

Publication series

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Keywords

EGS Disciplines

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