Silicon solar cells using backside contacts with through-wafer interconnects

Aaron Erbe; A. J. Moll

doi:10.1109/WMED.2006.1678309

Silicon solar cells using backside contacts with through-wafer interconnects

Aaron Erbe, A. J. Moll

Micron School of Materials Science and Engineering

Boise State University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

In this paper, a viable alternative design for silicon solar cells using backside contacts with through-wafer interconnects (TWI) is discussed. TWI technology allows conductive paths to be created without sacrificing top surface area. Using this technology, we will be able to provide a connection from the top n-type material to the cathode at the rear of the solar cell. The potential advantages and the proposed design are also discussed.

Original language	English
Title of host publication	2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06
Pages	59-60
Number of pages	2
DOIs	https://doi.org/10.1109/WMED.2006.1678309
State	Published - 2006
Event	2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06 - Boise, ID, United States Duration: 14 Apr 2006 → 14 Apr 2006

Publication series

Name	2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06

Conference

Conference	2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06
Country/Territory	United States
City	Boise, ID
Period	14/04/06 → 14/04/06

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10.1109/WMED.2006.1678309

Cite this

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title = "Silicon solar cells using backside contacts with through-wafer interconnects",

abstract = "In this paper, a viable alternative design for silicon solar cells using backside contacts with through-wafer interconnects (TWI) is discussed. TWI technology allows conductive paths to be created without sacrificing top surface area. Using this technology, we will be able to provide a connection from the top n-type material to the cathode at the rear of the solar cell. The potential advantages and the proposed design are also discussed.",

author = "Aaron Erbe and Moll, {A. J.}",

year = "2006",

doi = "10.1109/WMED.2006.1678309",

language = "English",

isbn = "142440374X",

series = "2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06",

pages = "59--60",

booktitle = "2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06",

note = "2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06 ; Conference date: 14-04-2006 Through 14-04-2006",

}

Erbe, A & Moll, AJ 2006, Silicon solar cells using backside contacts with through-wafer interconnects. in 2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06., 1678309, 2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06, pp. 59-60, 2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06, Boise, ID, United States, 14/04/06. https://doi.org/10.1109/WMED.2006.1678309

Silicon solar cells using backside contacts with through-wafer interconnects. / Erbe, Aaron; Moll, A. J.
2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06. 2006. p. 59-60 1678309 (2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Silicon solar cells using backside contacts with through-wafer interconnects

AU - Erbe, Aaron

AU - Moll, A. J.

PY - 2006

Y1 - 2006

N2 - In this paper, a viable alternative design for silicon solar cells using backside contacts with through-wafer interconnects (TWI) is discussed. TWI technology allows conductive paths to be created without sacrificing top surface area. Using this technology, we will be able to provide a connection from the top n-type material to the cathode at the rear of the solar cell. The potential advantages and the proposed design are also discussed.

AB - In this paper, a viable alternative design for silicon solar cells using backside contacts with through-wafer interconnects (TWI) is discussed. TWI technology allows conductive paths to be created without sacrificing top surface area. Using this technology, we will be able to provide a connection from the top n-type material to the cathode at the rear of the solar cell. The potential advantages and the proposed design are also discussed.

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U2 - 10.1109/WMED.2006.1678309

DO - 10.1109/WMED.2006.1678309

M3 - Conference contribution

AN - SCOPUS:34250161779

SN - 142440374X

SN - 9781424403745

T3 - 2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06

SP - 59

EP - 60

BT - 2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06

T2 - 2006 IEEE Workshop on Microelectronics and Electron Devices, WMED'06

Y2 - 14 April 2006 through 14 April 2006

ER -

Silicon solar cells using backside contacts with through-wafer interconnects

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