TY - GEN
T1 - The effect of die attach voiding on the thermal resistance of chip level packages
AU - Fleischer, Amy S.
AU - Chang, Li Hsin
AU - Johnson, Barry C.
PY - 2005
Y1 - 2005
N2 - During semiconductor manufacturing, voids are easily formed in the die attach bond layer and are found to form, grow and coalesce with thermal cycling. The presence of such voids is known to adversely affect the package thermal resistance, but to this point, not enough data exists to precisely analyze the effects of void size, configuration and depth. Using an innovative experimental method the present study investigates these effects with a carefully controlled void geometry. The results show that the thermal resistance increases linearly with void percentage for random voids, but increases exponentially for contiguous voids.
AB - During semiconductor manufacturing, voids are easily formed in the die attach bond layer and are found to form, grow and coalesce with thermal cycling. The presence of such voids is known to adversely affect the package thermal resistance, but to this point, not enough data exists to precisely analyze the effects of void size, configuration and depth. Using an innovative experimental method the present study investigates these effects with a carefully controlled void geometry. The results show that the thermal resistance increases linearly with void percentage for random voids, but increases exponentially for contiguous voids.
UR - http://www.scopus.com/inward/record.url?scp=32844461714&partnerID=8YFLogxK
U2 - 10.1115/ipack2005-73224
DO - 10.1115/ipack2005-73224
M3 - Conference contribution
AN - SCOPUS:32844461714
SN - 0791842002
SN - 9780791842003
T3 - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
SP - 299
EP - 304
BT - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
T2 - ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Y2 - 17 July 2005 through 22 July 2005
ER -