TY - GEN
T1 - The influence of nanoparticle loading and surfactant on the viscosity of nanoenhanced energy storage materials
AU - Weigand, Rebecca
AU - Fleischer, Amy S.
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/9/4
Y1 - 2014/9/4
N2 - Solid-liquid phase change materials (PCMs) can be used as a transient thermal management technique due to their ability to store significant amounts of heat through the solid liquid phase change. It is common to improve the low thermal conductivity of PCMs by adding nanoparticles, however, this addition changes some of the physical properties of the material, including viscosity, possibly hindering convection currents seen in the liquid state. The dynamic viscosity of nano-enhanced materials is examined in this paper as a function of shear rate and temperature. The materials used are paraffin wax enhanced with herringbone style graphite nanofibers (HGNFs) in 0.1% and 0.5% volume fractions with and without oleic acid. The nano-enhanced materials are found to be Newtonian in nature and to decrease in viscosity as temperature increases.
AB - Solid-liquid phase change materials (PCMs) can be used as a transient thermal management technique due to their ability to store significant amounts of heat through the solid liquid phase change. It is common to improve the low thermal conductivity of PCMs by adding nanoparticles, however, this addition changes some of the physical properties of the material, including viscosity, possibly hindering convection currents seen in the liquid state. The dynamic viscosity of nano-enhanced materials is examined in this paper as a function of shear rate and temperature. The materials used are paraffin wax enhanced with herringbone style graphite nanofibers (HGNFs) in 0.1% and 0.5% volume fractions with and without oleic acid. The nano-enhanced materials are found to be Newtonian in nature and to decrease in viscosity as temperature increases.
KW - dynamic viscosity
KW - phase change material
UR - http://www.scopus.com/inward/record.url?scp=84907683642&partnerID=8YFLogxK
U2 - 10.1109/ITHERM.2014.6892369
DO - 10.1109/ITHERM.2014.6892369
M3 - Conference contribution
AN - SCOPUS:84907683642
T3 - Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
SP - 846
EP - 850
BT - Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 14th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014
Y2 - 27 May 2014 through 30 May 2014
ER -