Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser

A. S. Fleischer; U. Troppenz; M. Hamacher; W. John

doi:10.1016/j.microrel.2005.04.010

Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser

A. S. Fleischer, U. Troppenz, M. Hamacher, W. John

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

The vertical coupling of active InP based ring resonators and passive feeding waveguides necessitates the use of a waferbonding technology in the fabrication process. The required bond material (BCB) has a low thermal conductivity and will strongly influence the operating temperature and thus the performance of the ring resonator through its insulating effect. A comprehensive thermal analysis of a proposed vertically coupled ring resonator of 50 μm outer radius is undertaken during the design phase to determine the thermal impact of: the design of the wafer bond, the design of the passivation layer and the optical power levels. Thermal abatement strategies for semiconductor lasers are presented.

Original language	English
Pages (from-to)	421-431
Number of pages	11
Journal	Microelectronics Reliability
Volume	46
Issue number	2-4
DOIs	https://doi.org/10.1016/j.microrel.2005.04.010
State	Published - Feb 2006
Externally published	Yes

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abstract = "The vertical coupling of active InP based ring resonators and passive feeding waveguides necessitates the use of a waferbonding technology in the fabrication process. The required bond material (BCB) has a low thermal conductivity and will strongly influence the operating temperature and thus the performance of the ring resonator through its insulating effect. A comprehensive thermal analysis of a proposed vertically coupled ring resonator of 50 μm outer radius is undertaken during the design phase to determine the thermal impact of: the design of the wafer bond, the design of the passivation layer and the optical power levels. Thermal abatement strategies for semiconductor lasers are presented.",

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AU - Fleischer, A. S.

AU - Troppenz, U.

AU - Hamacher, M.

AU - John, W.

PY - 2006/2

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AB - The vertical coupling of active InP based ring resonators and passive feeding waveguides necessitates the use of a waferbonding technology in the fabrication process. The required bond material (BCB) has a low thermal conductivity and will strongly influence the operating temperature and thus the performance of the ring resonator through its insulating effect. A comprehensive thermal analysis of a proposed vertically coupled ring resonator of 50 μm outer radius is undertaken during the design phase to determine the thermal impact of: the design of the wafer bond, the design of the passivation layer and the optical power levels. Thermal abatement strategies for semiconductor lasers are presented.

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JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 2-4

ER -

Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser

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