Thermal challenges in next-generation electronic systems

Suresh V. Garimella; Amy S. Fleischer; Jayathi Y. Murthy; Ali Keshavarzi; Ravi Prasher; Chandrakant Patel; Sushil H. Bhavnani; Rama Venkatasubramanian; Ravi Mahajan; Yogendra Joshi; Bahgat Sammakia; Bruce A. Myers; Len Chorosinski; Martine Baelmans; Prabhu Sathyamurthy; Peter E. Raad

doi:10.1109/TCAPT.2008.2001197

Thermal challenges in next-generation electronic systems

Suresh V. Garimella, Amy S. Fleischer, Jayathi Y. Murthy, Ali Keshavarzi, Ravi Prasher, Chandrakant Patel, Sushil H. Bhavnani, Rama Venkatasubramanian, Ravi Mahajan, Yogendra Joshi, Bahgat Sammakia, Bruce A. Myers, Len Chorosinski, Martine Baelmans, Prabhu Sathyamurthy, Peter E. Raad

Research output: Contribution to journal › Article › peer-review

433 Scopus citations

Abstract

Thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this paper. Diverse topics are covered, including electrothermal and multiphysics codesign of electronics, new and nanostructured materials, high heat flux thermal management, site-specific thermal management, thermal design of next-generation data centers, thermal challenges for military, automotive, and harsh environment electronic systems, progress and challenges in software tools, and advances in measurement and characterization. Barriers to further progress in each area that require the attention of the research community are identified.

Original language	English
Pages (from-to)	801-815
Number of pages	15
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	31
Issue number	4
DOIs	https://doi.org/10.1109/TCAPT.2008.2001197
State	Published - 2008
Externally published	Yes

Keywords

Electronics cooling
Thermal management
Trends

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Garimella, S. V., Fleischer, A. S., Murthy, J. Y., Keshavarzi, A., Prasher, R., Patel, C., Bhavnani, S. H., Venkatasubramanian, R., Mahajan, R., Joshi, Y., Sammakia, B., Myers, B. A., Chorosinski, L., Baelmans, M., Sathyamurthy, P., & Raad, P. E. (2008). Thermal challenges in next-generation electronic systems. IEEE Transactions on Components and Packaging Technologies, 31(4), 801-815. https://doi.org/10.1109/TCAPT.2008.2001197

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abstract = "Thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this paper. Diverse topics are covered, including electrothermal and multiphysics codesign of electronics, new and nanostructured materials, high heat flux thermal management, site-specific thermal management, thermal design of next-generation data centers, thermal challenges for military, automotive, and harsh environment electronic systems, progress and challenges in software tools, and advances in measurement and characterization. Barriers to further progress in each area that require the attention of the research community are identified.",

keywords = "Electronics cooling, Thermal management, Trends",

author = "Garimella, {Suresh V.} and Fleischer, {Amy S.} and Murthy, {Jayathi Y.} and Ali Keshavarzi and Ravi Prasher and Chandrakant Patel and Bhavnani, {Sushil H.} and Rama Venkatasubramanian and Ravi Mahajan and Yogendra Joshi and Bahgat Sammakia and Myers, {Bruce A.} and Len Chorosinski and Martine Baelmans and Prabhu Sathyamurthy and Raad, {Peter E.}",

year = "2008",

doi = "10.1109/TCAPT.2008.2001197",

language = "English",

volume = "31",

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Garimella, SV, Fleischer, AS, Murthy, JY, Keshavarzi, A, Prasher, R, Patel, C, Bhavnani, SH, Venkatasubramanian, R, Mahajan, R, Joshi, Y, Sammakia, B, Myers, BA, Chorosinski, L, Baelmans, M, Sathyamurthy, P & Raad, PE 2008, 'Thermal challenges in next-generation electronic systems', IEEE Transactions on Components and Packaging Technologies, vol. 31, no. 4, pp. 801-815. https://doi.org/10.1109/TCAPT.2008.2001197

TY - JOUR

T1 - Thermal challenges in next-generation electronic systems

AU - Garimella, Suresh V.

AU - Fleischer, Amy S.

AU - Murthy, Jayathi Y.

AU - Keshavarzi, Ali

AU - Prasher, Ravi

AU - Patel, Chandrakant

AU - Bhavnani, Sushil H.

AU - Venkatasubramanian, Rama

AU - Mahajan, Ravi

AU - Joshi, Yogendra

AU - Sammakia, Bahgat

AU - Myers, Bruce A.

AU - Chorosinski, Len

AU - Baelmans, Martine

AU - Sathyamurthy, Prabhu

AU - Raad, Peter E.

PY - 2008

Y1 - 2008

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AB - Thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this paper. Diverse topics are covered, including electrothermal and multiphysics codesign of electronics, new and nanostructured materials, high heat flux thermal management, site-specific thermal management, thermal design of next-generation data centers, thermal challenges for military, automotive, and harsh environment electronic systems, progress and challenges in software tools, and advances in measurement and characterization. Barriers to further progress in each area that require the attention of the research community are identified.

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Thermal challenges in next-generation electronic systems

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Keywords

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