Thermal characterization of an all-active microring resonating laser

Amy S. Fleischer; Michael Harnacher; Ute Troppenz; Werner John

doi:10.1115/IMECE2004-60399

Thermal characterization of an all-active microring resonating laser

Amy S. Fleischer, Michael Harnacher, Ute Troppenz, Werner John

Research output: Contribution to journal › Conference article › peer-review

Abstract

Active microring optical devices are promising candidates for use in next generation optical signal processing and sensor products. In this design, an InP based microring laser is vertically coupled to a passive feeding waveguides using a waferbonding technology. The vertical coupling is expected to detrimentally affect the operating temperature and device performance through the low thermal conductivity of the bond material. Thus, a thermal analysis is undertaken in the design stage to better understand the implications of this fabrication process. A thermal analysis of a basic microring resonator of 50 μm radius and 100 mW power dissipation is presented and thermal design variations are discussed.

Original language	English
Article number	IMECE2004-60399
Pages (from-to)	221-226
Number of pages	6
Journal	American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Volume	375
Issue number	2
DOIs	https://doi.org/10.1115/IMECE2004-60399
State	Published - 2004
Externally published	Yes
Event	2004 ASME International Mechanical Engineering Congress and Exposition, IMECE - Anaheim, CA, United States Duration: 13 Nov 2004 → 19 Nov 2004

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10.1115/IMECE2004-60399

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title = "Thermal characterization of an all-active microring resonating laser",

abstract = "Active microring optical devices are promising candidates for use in next generation optical signal processing and sensor products. In this design, an InP based microring laser is vertically coupled to a passive feeding waveguides using a waferbonding technology. The vertical coupling is expected to detrimentally affect the operating temperature and device performance through the low thermal conductivity of the bond material. Thus, a thermal analysis is undertaken in the design stage to better understand the implications of this fabrication process. A thermal analysis of a basic microring resonator of 50 μm radius and 100 mW power dissipation is presented and thermal design variations are discussed.",

author = "Fleischer, {Amy S.} and Michael Harnacher and Ute Troppenz and Werner John",

year = "2004",

doi = "10.1115/IMECE2004-60399",

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journal = "American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD",

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AU - Fleischer, Amy S.

AU - Harnacher, Michael

AU - Troppenz, Ute

AU - John, Werner

PY - 2004

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N2 - Active microring optical devices are promising candidates for use in next generation optical signal processing and sensor products. In this design, an InP based microring laser is vertically coupled to a passive feeding waveguides using a waferbonding technology. The vertical coupling is expected to detrimentally affect the operating temperature and device performance through the low thermal conductivity of the bond material. Thus, a thermal analysis is undertaken in the design stage to better understand the implications of this fabrication process. A thermal analysis of a basic microring resonator of 50 μm radius and 100 mW power dissipation is presented and thermal design variations are discussed.

AB - Active microring optical devices are promising candidates for use in next generation optical signal processing and sensor products. In this design, an InP based microring laser is vertically coupled to a passive feeding waveguides using a waferbonding technology. The vertical coupling is expected to detrimentally affect the operating temperature and device performance through the low thermal conductivity of the bond material. Thus, a thermal analysis is undertaken in the design stage to better understand the implications of this fabrication process. A thermal analysis of a basic microring resonator of 50 μm radius and 100 mW power dissipation is presented and thermal design variations are discussed.

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U2 - 10.1115/IMECE2004-60399

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M3 - Conference article

AN - SCOPUS:20344406822

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JO - American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

JF - American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

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T2 - 2004 ASME International Mechanical Engineering Congress and Exposition, IMECE

Y2 - 13 November 2004 through 19 November 2004

ER -

Thermal characterization of an all-active microring resonating laser

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