TY - GEN
T1 - Thermal management of heat generating devices in close proximity on printed circuit boards
AU - Harvest, Jared
AU - Fleischer, Amy S.
AU - Weinstein, Randy D.
PY - 2005
Y1 - 2005
N2 - This study uses experimentally validated computational fluid dynamics models to predict the behavior of the localized thermal interactions between adjacent components on vertically orientated circuit boards in natural convection. Using the developed models, the effects of power density, component proximity, component geometry, circuit board material, board packing density and board separation distance on the maintenance of optimal operating temperatures for all components are investigated. The device separation distance beyond which the components no longer thermally influence each other is identified and the influence of various parameters on this distance is studied. The parametric study is designed using Design of Experiments methodology to best interpret the interaction between parameters and can easily be applied to other packaging situations to allow designers to optimally place components on a circuit board in close proximity to minimize negative thermal interactions.
AB - This study uses experimentally validated computational fluid dynamics models to predict the behavior of the localized thermal interactions between adjacent components on vertically orientated circuit boards in natural convection. Using the developed models, the effects of power density, component proximity, component geometry, circuit board material, board packing density and board separation distance on the maintenance of optimal operating temperatures for all components are investigated. The device separation distance beyond which the components no longer thermally influence each other is identified and the influence of various parameters on this distance is studied. The parametric study is designed using Design of Experiments methodology to best interpret the interaction between parameters and can easily be applied to other packaging situations to allow designers to optimally place components on a circuit board in close proximity to minimize negative thermal interactions.
UR - http://www.scopus.com/inward/record.url?scp=29644432116&partnerID=8YFLogxK
U2 - 10.1115/HT2005-72254
DO - 10.1115/HT2005-72254
M3 - Conference contribution
AN - SCOPUS:29644432116
SN - 0791847314
SN - 9780791847312
T3 - Proceedings of the ASME Summer Heat Transfer Conference
SP - 599
EP - 605
BT - Proceedings of the ASME Summer Heat Transfer Conference, HT 2005
T2 - 2005 ASME Summer Heat Transfer Conference, HT 2005
Y2 - 17 July 2005 through 22 July 2005
ER -