Skip to main navigation
Skip to search
Skip to main content

Boise State University Home

Home
Profiles
Research units
Equipment
Projects
Research output
Datasets
Prizes
Activities
Press/Media
Student theses

Search by expertise, name or affiliation

Thermal Stability of Cu-Sn Metal-Metal Interconnects

Jemima Fernandez
, Megan Frary
, Amy Moll

Micron School of Materials Science and Engineering
Center for Teaching and Learning

Boise State University

Research output: Contribution to conference › Presentation

Overview
Fingerprint

Fingerprint

Dive into the research topics of 'Thermal Stability of Cu-Sn Metal-Metal Interconnects'. Together they form a unique fingerprint.

Sort by
Weight
Alphabetically

Chemistry

Powered by Pure, Scopus & Elsevier Fingerprint Engine™

All content on this site: Copyright © 2026 Boise State University, its licensors, and contributors. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For all open access content, the relevant licensing terms apply

We use cookies to help provide and enhance our service and tailor content. By continuing you agree to the use of cookies

Boise State University data protection policy

About web accessibility

Report vulnerability