Through wafer interconnects on active pMOS devices

Vaughn N. Johnson, Jim Jozwiak, Amy Moll

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

The objective of this research is to demonstrate the ability to create Through-Wafer Interconnects (TWI's) on wafers with active devices. TWI's have previously been demonstrated on blank Si wafers. The application of TWI's in an industrial setting requires no damage or yield loss to the existing devices during additional processing steps. The test vehicle chosen is a simple pMOS test chip, which includes different structures such as transistors and inverters. The processing steps and sequence required to integrate TWI's into wafers with active devices will be demonstrated.

Original languageEnglish
Title of host publication2004 IEEE Workshop on Microelectronics and Electron Devices, WMED 2004
Subtitle of host publicationIEEE Electron Devices 2nd Northwest Regional Meeting
Pages82-84
Number of pages3
StatePublished - 2004
Event2004 IEEE Workshop on Microelectronics and Electron Devices, WMED 2004: IEEE Electron Devices Northwest Regional Meeting - Boise, ID, United States
Duration: 16 Apr 200416 Apr 2004

Publication series

NameIEEE Workshop on Microelectronics and Electron Devices, WMED: IEEE Electron Devices Northwest Regional Meeting

Conference

Conference2004 IEEE Workshop on Microelectronics and Electron Devices, WMED 2004: IEEE Electron Devices Northwest Regional Meeting
Country/TerritoryUnited States
CityBoise, ID
Period16/04/0416/04/04

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