TY - GEN
T1 - Transient thermal management using phase change materials with embedded graphite nanofibers for systems with high power requirements
AU - Fleischer, Amy S.
AU - Chintakrinda, Kireeti
AU - Weinstein, Randy
AU - Bessel, Carol A.
PY - 2008
Y1 - 2008
N2 - Phase change materials (PCMs) exhibit excellent thermal storage capacity due to their high latent heat of transformation and have been successfully utilized in small volumes for transient thermal management of electronics. However, their low thermal conductivity makes it difficult to utilize large volumes of PCMs for transient thermal management of larger systems. To improve the thermal performance, high thermal conductivity graphite nanofibers are embedded into a paraffin PCM. The thermal effects of fiber loading levels, measured in weight percent (0 to 10%) are examined for a system with power loads between 100 and 700 W. The use of the graphite nanofiber enhancement is found to double the useful performance time of the PCM and lower the system operating temperature.
AB - Phase change materials (PCMs) exhibit excellent thermal storage capacity due to their high latent heat of transformation and have been successfully utilized in small volumes for transient thermal management of electronics. However, their low thermal conductivity makes it difficult to utilize large volumes of PCMs for transient thermal management of larger systems. To improve the thermal performance, high thermal conductivity graphite nanofibers are embedded into a paraffin PCM. The thermal effects of fiber loading levels, measured in weight percent (0 to 10%) are examined for a system with power loads between 100 and 700 W. The use of the graphite nanofiber enhancement is found to double the useful performance time of the PCM and lower the system operating temperature.
KW - Graphite
KW - Nanofibers
KW - Nanomaterials
KW - PCM
KW - Phase change materials
KW - Thermal management of electronics
KW - Transient thermal management
UR - http://www.scopus.com/inward/record.url?scp=50949085884&partnerID=8YFLogxK
U2 - 10.1109/ITHERM.2008.4544317
DO - 10.1109/ITHERM.2008.4544317
M3 - Conference contribution
AN - SCOPUS:50949085884
SN - 9781424417018
T3 - 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM
SP - 561
EP - 566
BT - 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM
T2 - 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM
Y2 - 28 May 2008 through 31 May 2008
ER -