TY - GEN
T1 - Viscoelastic material characterization of SU-8 and carbon-nanotube- reinforced SU-8 materials
AU - Seungbae, Park
AU - Soonwan, Chung
AU - Ackler, Harold
AU - Makhar, Sandeep
PY - 2006
Y1 - 2006
N2 - The viscoelastic material properties of SU-8 and carbon nanotube-reinforced SU-8 composite material are characterized by tensile testing. Dogbone samples of 0.1mm thickness are prepared by micro-fabrication process, which is composed of spin coat, soft bake, expose, and post exposure bake. To fabricate CNT polymer composite, carbon nano-tube of 0.2wt% is mixed with SU-8. To observe the effect of applied strain rate and temperature on Young's modulus and Poisson's ratio, strain rate is varied from 5×10-5 to 2.5×10 -4 (/sec) at elevated temperatures in the range of 25 to 200°C. Since the viscoelastic material properties are important in polymer, creep, stress relaxation and dynamic mechanical analyses are performed at elevated temperatures. The viscoelastic material properties of SU-8 and CNT-reinforced SU-8 composite are compared, and the mechanical reliability of these polymers in MEMS applications is discussed.
AB - The viscoelastic material properties of SU-8 and carbon nanotube-reinforced SU-8 composite material are characterized by tensile testing. Dogbone samples of 0.1mm thickness are prepared by micro-fabrication process, which is composed of spin coat, soft bake, expose, and post exposure bake. To fabricate CNT polymer composite, carbon nano-tube of 0.2wt% is mixed with SU-8. To observe the effect of applied strain rate and temperature on Young's modulus and Poisson's ratio, strain rate is varied from 5×10-5 to 2.5×10 -4 (/sec) at elevated temperatures in the range of 25 to 200°C. Since the viscoelastic material properties are important in polymer, creep, stress relaxation and dynamic mechanical analyses are performed at elevated temperatures. The viscoelastic material properties of SU-8 and CNT-reinforced SU-8 composite are compared, and the mechanical reliability of these polymers in MEMS applications is discussed.
UR - http://www.scopus.com/inward/record.url?scp=85196548236&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85196548236
SN - 0791837904
SN - 9780791837900
T3 - American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
BT - Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging
T2 - 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006
Y2 - 5 November 2006 through 10 November 2006
ER -